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LTM4632IV#PBF - Analog Devices

Description: Switching Voltage Regulators Ultrathin, Triple uModule Regulator for QDR-DDR SRAM

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LTM4632IV#PBF - Analog Devices PCB footprint - BGA - BGA - LGA Package 25-Lead (6.25mm × 6.25mm × 1.82mm)
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3D Models
LTM4632IV#PBF - Analog Devices  - 3D model - BGA - LGA Package 25-Lead (6.25mm × 6.25mm × 1.82mm)
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LTM4632IV#PBF Details

  • Manufacturer Part Number:

    LTM4632IV#PBF

  • Brand Name:

    Analog Devices Inc

  • Pbfree Code:

    No

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Pin Count:

    25

  • Manufacturer Package Code:

    05-08-1949

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    10

  • Additional Feature:

    OUTPUT VOLTAGE RANGE FROM 0.6 V TO 2.5 V

  • Analog IC - Other Type:

    SWITCHING REGULATOR

  • Control Mode:

    CURRENT-MODE

  • Control Technique:

    PULSE WIDTH MODULATION

  • Input Voltage-Max:

    15 V

  • Input Voltage-Min:

    3.6 V

  • Input Voltage-Nom:

    12 V

  • JESD-30 Code:

    S-XBGA-N25

  • JESD-609 Code:

    e4

  • Length:

    6.25 mm

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    1

  • Number of Terminals:

    25

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    UNSPECIFIED

  • Package Code:

    LGA

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    1.92 mm

  • Surface Mount:

    YES

  • Switcher Configuration:

    BUCK

  • Switching Frequency-Max:

    1000 kHz

  • Technology:

    HYBRID

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Gold (Au)

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    6.25 mm

LTM4632IV#PBF Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a solid ground plane and thermal vias is recommended. The device's thermal pad should be connected to the ground plane using multiple thermal vias to ensure good heat dissipation.
  • Monitor the device's junction temperature, input voltage, and output current to ensure they are within the specified limits. Also, ensure the device is properly heatsinked and the PCB is designed for good thermal dissipation.
  • A low-ESR ceramic capacitor with a value of 10uF to 22uF is recommended. The capacitor should be placed close to the VIN pin to minimize inductance and ensure good decoupling.
  • Use a low-ESR output capacitor with a value of 10uF to 22uF. Ensure the output capacitor is placed close to the output pins and the PCB is designed to minimize inductance and noise.
  • A heatsink with a thermal resistance of 5°C/W or lower is recommended. The heatsink should be designed to ensure good airflow and should be attached to the device using a thermal interface material with a thermal resistance of 0.5°C-in²/W or lower.

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LTM4632IV#PBF Overview

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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