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LTM4653EY#PBF - Analog Devices

Description: Module DC-DC 1-OUT 0.5V to 54.52V 4A 77-Pin BGA Tray

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LTM4653EY#PBF - Analog Devices PCB footprint - BGA - BGA - BGA Package 77-Lead (15.00mm × 9.00mm × 5.01mm)-1
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LTM4653EY#PBF - Analog Devices  - 3D model - BGA - BGA Package 77-Lead (15.00mm × 9.00mm × 5.01mm)-1
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LTM4653EY#PBF Details

  • Manufacturer Part Number:

    LTM4653EY#PBF

  • Brand Name:

    Analog Devices Inc

  • Pbfree Code:

    No

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    BGA-77

  • Pin Count:

    77

  • Manufacturer Package Code:

    05-08-1826

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Date Of Intro:

    2018-04-09

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    9

  • Analog IC - Other Type:

    SWITCHING REGULATOR

  • Control Mode:

    CURRENT-MODE

  • Input Voltage-Max:

    58 V

  • Input Voltage-Min:

    3.1 V

  • Input Voltage-Nom:

    48 V

  • JESD-30 Code:

    R-PBGA-B77

  • JESD-609 Code:

    e1

  • Length:

    15 mm

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    1

  • Number of Terminals:

    77

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Current-Max:

    4 A

  • Output Voltage-Max:

    54.52 V

  • Output Voltage-Min:

    0.5 V

  • Output Voltage-Nom:

    24 V

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    BGA

  • Package Shape:

    RECTANGULAR

  • Package Style:

    GRID ARRAY

  • Seated Height-Max:

    5.21 mm

  • Surface Mount:

    YES

  • Switcher Configuration:

    BUCK

  • Switching Frequency-Max:

    3000 kHz

  • Technology:

    HYBRID

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Tin/Silver/Copper (Sn/Ag/Cu)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    BOTTOM

  • Width:

    9 mm

LTM4653EY#PBF Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a solid ground plane and thermal vias is recommended. The device's exposed pad should be connected to a thermal pad on the PCB, and the PCB should have a thermal relief pattern to facilitate heat dissipation.
  • Monitor the device's junction temperature, input voltage, and output current to ensure they are within the specified limits. Also, ensure the device is properly heatsinked and the PCB is designed for optimal thermal performance.
  • A low-ESR ceramic capacitor with a value of 10uF to 22uF is recommended. The capacitor should be placed as close to the device's input pins as possible to minimize noise and ensure stable operation.
  • Use a shielded enclosure, keep the device and its associated components away from sensitive circuits, and use a common-mode choke or ferrite bead to filter the input voltage. Also, ensure the PCB is designed with EMI reduction in mind, using techniques such as grounding, shielding, and layout optimization.
  • A low-ESR ceramic capacitor with a value of 10uF to 47uF is recommended. The capacitor should be placed as close to the device's output pins as possible to minimize noise and ensure stable operation.

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LTM4653EY#PBF Overview

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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