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LTM4655MPY#PBF - Analog Devices

Description: EN55022B Compliant 40V, Dual 4A or Single 8A Step-Down or 50W Inverting μModule Regulator

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LTM4655MPY#PBF - Analog Devices - PCB symbol
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PCB Footprints
LTM4655MPY#PBF - Analog Devices PCB footprint - BGA - BGA - BGA Package 144-Lead (16mm × 16mm × 5.01mm) (Reference DWG # 05-08-1551)
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LTM4655MPY#PBF - Analog Devices - 3D model - BGA - BGA Package 144-Lead (16mm × 16mm × 5.01mm) (Reference DWG # 05-08-1551)
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LTM4655MPY#PBF Details

  • Manufacturer Part Number:

    LTM4655MPY#PBF

  • Brand Name:

    Analog Devices Inc

  • Pbfree Code:

    No

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    BGA-144

  • Pin Count:

    144

  • Manufacturer Package Code:

    05-08-1920

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    8.5

  • Analog IC - Other Type:

    DUAL SWITCHING CONTROLLER

  • Control Mode:

    CURRENT-MODE

  • Control Technique:

    PULSE WIDTH MODULATION

  • Input Voltage-Max:

    40 V

  • Input Voltage-Min:

    3.1 V

  • Input Voltage-Nom:

    36 V

  • JESD-30 Code:

    S-PBGA-B144

  • JESD-609 Code:

    e1

  • Length:

    16 mm

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    1

  • Number of Terminals:

    144

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -55 °C

  • Output Current-Max:

    8 A

  • Output Voltage-Max:

    26.5 V

  • Output Voltage-Min:

    0.5 V

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    BGA

  • Package Equivalence Code:

    BGA144,12X12,50

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY, LOW PROFILE, FINE PITCH

  • Peak Reflow Temperature (Cel):

    245

  • Seated Height-Max:

    5.21 mm

  • Surface Mount:

    YES

  • Switcher Configuration:

    BUCK

  • Switching Frequency-Max:

    3000 kHz

  • Technology:

    HYBRID

  • Terminal Finish:

    Tin/Silver/Copper (Sn/Ag/Cu)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    16 mm

LTM4655MPY#PBF Frequently Asked Questions (FAQs)

  • The recommended PCB layout for optimal thermal performance involves placing the device on a 2-layer or 4-layer board with a solid ground plane on the bottom layer, and using thermal vias to connect the exposed pad to the ground plane. Additionally, keeping the thermal path short and using a heat sink can help to improve thermal performance.
  • To ensure reliable operation in high-temperature environments, it is recommended to follow proper thermal design and layout guidelines, use a heat sink if necessary, and ensure that the device is operated within its specified temperature range. Additionally, using a thermistor or temperature sensor to monitor the device temperature can help to prevent overheating.
  • Using a lower input voltage than the recommended 3.3V or 5V may result in reduced output current capability and efficiency, while using a higher input voltage may result in increased power dissipation and reduced reliability. It is recommended to operate the device within the specified input voltage range to ensure optimal performance and reliability.
  • To troubleshoot issues with the device's output voltage regulation, check the input voltage, output load, and feedback resistors to ensure they are within the specified ranges. Also, verify that the device is properly configured and that the output voltage is within the specified range. If the issue persists, consult the datasheet and application notes for further guidance.
  • The LTM4655MPY#PBF is designed to meet CISPR 22 Class B EMI standards, but proper PCB layout, grounding, and shielding are still necessary to minimize EMI and RFI. It is recommended to follow good design practices, such as using a solid ground plane, minimizing loop areas, and using EMI filters or shielding if necessary.

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LTM4655MPY#PBF Overview

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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