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LTM4709EY#PBF - Analog Devices

Description: Triple 3A, Ultralow Noise, High PSRR, Ultrafast μModule Linear Regulator with Configurable Output Array

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LTM4709EY#PBF - Analog Devices PCB footprint - BGA - BGA - LTM4709EY#PBF
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LTM4709EY#PBF Details

  • Manufacturer Part Number:

    LTM4709EY#PBF

  • Brand Name:

    Analog Devices Inc

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    CHIP SCALE BGA

  • Package Description:

    BGA-98

  • Pin Count:

    98

  • Manufacturer Package Code:

    CHIP SCALE BGA

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Date Of Intro:

    2023-07-19

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    8.5

  • Adjustability:

    ADJUSTABLE

  • Dropout Voltage1-Max:

    0.1 V

  • Dropout Voltage1-Nom:

    0.045 V

  • Dropout Voltage2-Max:

    0.1 V

  • JESD-30 Code:

    R-PBGA-B98

  • Length:

    12 mm

  • Line Regulation-Max (%/V):

    0.327

  • Load Regulation-Max(%):

    0.26%

  • Moisture Sensitivity Level:

    4

  • Number of Functions:

    1

  • Number of Outputs:

    3

  • Number of Terminals:

    98

  • Operating Temperature TJ-Max:

    125 °C

  • Operating Temperature TJ-Min:

    -40 °C

  • Output Current1-Max:

    3 A

  • Output Current2-Max:

    3 A

  • Output Voltage1-Max:

    4.2 V

  • Output Voltage1-Min:

    0.5 V

  • Output Voltage2-Max:

    4.2 V

  • Output Voltage2-Min:

    0.5 V

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    FBGA

  • Package Equivalence Code:

    BGA98,7X14,32

  • Package Shape:

    RECTANGULAR

  • Package Style:

    GRID ARRAY, FINE PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Regulator Type:

    ADJUSTABLE POSITIVE MULTIPLE OUTPUT LDO REGULATOR

  • Seated Height-Max:

    2.11 mm

  • Surface Mount:

    YES

  • Technology:

    HYBRID

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.8 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    6 mm

LTM4709EY#PBF Frequently Asked Questions (FAQs)

  • A good PCB layout for optimal thermal performance involves placing the LTM4709EY#PBF near a thermal pad or a heat sink, and ensuring good airflow around the device. The datasheet provides a recommended PCB layout, but it's also recommended to consult with Analog Devices' application notes and thermal management guidelines for more detailed information.
  • To ensure reliable operation in high-temperature environments, it's essential to follow proper thermal design and management practices. This includes selecting a suitable heat sink, ensuring good airflow, and monitoring the device's junction temperature. Additionally, the LTM4709EY#PBF has built-in thermal protection features, such as overtemperature protection and thermal shutdown, which can help prevent damage from excessive temperatures.
  • Using a lower or higher input voltage than the recommended 3.3V or 5V may affect the LTM4709EY#PBF's performance and efficiency. Operating at a lower input voltage may reduce the output current capability, while operating at a higher input voltage may increase the power dissipation and reduce the device's reliability. It's essential to consult the datasheet and application notes for specific guidance on input voltage ranges and their implications.
  • To troubleshoot issues with the LTM4709EY#PBF, start by reviewing the datasheet and application notes to ensure that the device is being used within its recommended operating conditions. Check the input voltage, output current, and thermal design to identify potential causes of the issue. Use oscilloscopes and thermal imaging tools to monitor the device's behavior and identify any anomalies. If the issue persists, consult with Analog Devices' technical support team for further assistance.
  • The LTM4709EY#PBF is designed to minimize electromagnetic interference (EMI) and radio-frequency interference (RFI). To further reduce EMI and RFI, use proper PCB layout techniques, such as separating analog and digital grounds, using shielding, and minimizing loop areas. Additionally, use EMI filters and shielding on the input and output lines, and ensure that the device is properly decoupled from the power supply.

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LTM4709EY#PBF Overview

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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