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LTM4709HY#PBF - Analog Devices

Description: Triple 3A, Ultralow Noise, High PSRR, Ultrafast μModule Linear Regulator with Configurable Output Array

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LTM4709HY#PBF - Analog Devices - PCB symbol
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PCB Footprints
LTM4709HY#PBF - Analog Devices PCB footprint - BGA - BGA - LTM4709HY#PBF
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LTM4709HY#PBF - Analog Devices - 3D model - BGA - LTM4709HY#PBF
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LTM4709HY#PBF Details

  • Manufacturer Part Number:

    LTM4709HY#PBF

  • Brand Name:

    Analog Devices Inc

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    CHIP SCALE BGA

  • Package Description:

    BGA-98

  • Pin Count:

    98

  • Manufacturer Package Code:

    CHIP SCALE BGA

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Date Of Intro:

    2023-07-19

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    8.5

  • Adjustability:

    ADJUSTABLE

  • Dropout Voltage1-Max:

    0.1 V

  • Dropout Voltage1-Nom:

    0.045 V

  • Dropout Voltage2-Max:

    0.1 V

  • JESD-30 Code:

    R-PBGA-B98

  • Length:

    12 mm

  • Line Regulation-Max (%/V):

    0.327

  • Load Regulation-Max(%):

    0.26%

  • Moisture Sensitivity Level:

    4

  • Number of Functions:

    1

  • Number of Outputs:

    3

  • Number of Terminals:

    98

  • Operating Temperature TJ-Max:

    150 °C

  • Operating Temperature TJ-Min:

    -40 °C

  • Output Current1-Max:

    3 A

  • Output Current2-Max:

    3 A

  • Output Voltage1-Max:

    4.2 V

  • Output Voltage1-Min:

    0.5 V

  • Output Voltage2-Max:

    4.2 V

  • Output Voltage2-Min:

    0.5 V

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    FBGA

  • Package Equivalence Code:

    BGA98,7X14,32

  • Package Shape:

    RECTANGULAR

  • Package Style:

    GRID ARRAY, FINE PITCH

  • Regulator Type:

    ADJUSTABLE POSITIVE MULTIPLE OUTPUT LDO REGULATOR

  • Seated Height-Max:

    2.11 mm

  • Surface Mount:

    YES

  • Technology:

    HYBRID

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.8 mm

  • Terminal Position:

    BOTTOM

  • Width:

    6 mm

LTM4709HY#PBF Frequently Asked Questions (FAQs)

  • A good PCB layout for optimal thermal performance involves placing the LTM4709HY#PBF near a thermal pad or a heat sink, and ensuring good airflow around the device. The datasheet provides a recommended PCB layout, but it's also recommended to consult with Analog Devices' application notes and thermal management guidelines for more detailed information.
  • To ensure reliable operation in high-temperature environments, it's essential to follow proper thermal management practices, such as providing adequate heat sinking, using thermal interface materials, and ensuring good airflow. Additionally, the LTM4709HY#PBF has a built-in thermal monitoring feature that can be used to detect overheating conditions and take corrective action.
  • Using a lower or higher input voltage than the recommended 3.3V or 5V may affect the performance and efficiency of the LTM4709HY#PBF. Operating at a lower input voltage may reduce the output current capability, while operating at a higher input voltage may increase the power dissipation and reduce the reliability of the device. It's recommended to consult with the datasheet and application notes for more detailed information on input voltage requirements.
  • To troubleshoot issues with the LTM4709HY#PBF, it's recommended to follow a systematic approach, starting with a review of the datasheet and application notes. Check the input voltage, output voltage, and current levels to ensure they are within the recommended specifications. Use oscilloscopes and other diagnostic tools to identify any anomalies or oscillations. Consult with Analog Devices' technical support resources, such as application notes and FAQs, for more detailed troubleshooting guidance.
  • The LTM4709HY#PBF is designed to meet EMI and RFI requirements, but it's still important to follow proper PCB layout and design practices to minimize electromagnetic interference. Use shielding, filtering, and grounding techniques to reduce EMI and RFI emissions. Consult with the datasheet and application notes for more detailed information on EMI and RFI considerations.

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LTM4709HY#PBF Overview

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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