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LTM4712EY#PBF - Analog Devices

Description: 36VIN, 12A Step-Up/Step-Down Buck-Boost μModule Regulator

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LTM4712EY#PBF - Analog Devices PCB footprint - BGA - BGA - LTM4712EY#PBF*
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LTM4712EY#PBF - Analog Devices  - 3D model - BGA - LTM4712EY#PBF*
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LTM4712EY#PBF Details

  • Manufacturer Part Number:

    LTM4712EY#PBF

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    BGA-144

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    8.5

  • Analog IC - Other Type:

    SWITCHING REGULATOR

  • Control Mode:

    CURRENT-MODE

  • Control Technique:

    PULSE SKIP MODE

  • Input Voltage-Max:

    36 V

  • Input Voltage-Min:

    5 V

  • Input Voltage-Nom:

    12 V

  • JESD-30 Code:

    S-PBGA-B144

  • Length:

    16 mm

  • Moisture Sensitivity Level:

    4

  • Number of Functions:

    1

  • Number of Terminals:

    144

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Current-Max:

    12 A

  • Output Voltage-Max:

    36 V

  • Output Voltage-Min:

    1 V

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    BGA

  • Package Equivalence Code:

    BGA144,12X12,50

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY

  • Seated Height-Max:

    8.68 mm

  • Surface Mount:

    YES

  • Switcher Configuration:

    BUCK

  • Switching Frequency-Max:

    600 kHz

  • Technology:

    HYBRID

  • Terminal Form:

    BALL

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    BOTTOM

  • Width:

    16 mm

LTM4712EY#PBF Frequently Asked Questions (FAQs)

  • A good PCB layout for optimal thermal performance involves placing the device near a thermal pad or heat sink, using thick copper traces for power and ground, and minimizing the number of vias under the device. A 4-layer PCB with a solid ground plane is also recommended.
  • To ensure reliable operation in high-temperature environments, it's essential to follow proper thermal design and layout guidelines, use a heat sink if necessary, and consider derating the device's output current and voltage according to the datasheet's thermal derating curves.
  • The recommended input capacitors are low-ESR ceramic capacitors with a value of 10uF to 22uF, and the recommended output capacitors are low-ESR ceramic or polymer capacitors with a value of 10uF to 47uF. The capacitor selection should be based on the specific application's requirements and the device's operating frequency.
  • To troubleshoot oscillations or instability issues, check the PCB layout for any signs of resonance or noise coupling, ensure that the input and output capacitors are properly selected and placed, and verify that the device is operated within its recommended operating conditions. Additionally, check for any signs of overheating or thermal issues.
  • The recommended soldering profile for the LTM4712EY#PBF is a reflow profile with a peak temperature of 260°C, a dwell time above 220°C of 30-60 seconds, and a ramp rate of 3°C/second. It's essential to follow the recommended soldering profile to prevent damage to the device.

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LTM4712EY#PBF Overview

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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