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LTM8026IY#PBF - Analog Devices

Description: LINEAR TECHNOLOGY - LTM8026IY#PBF - DC/DC CONV, BUCK, 1MHZ, BGA-81

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PCB Footprints
LTM8026IY#PBF - Analog Devices PCB footprint - BGA - BGA - BGA Package 81-Lead (15mm × 11.25mm × 3.42mm) (Reference LTC DWG # 05-08-1959 Rev A)
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3D Models
LTM8026IY#PBF - Analog Devices  - 3D model - BGA - BGA Package 81-Lead (15mm × 11.25mm × 3.42mm) (Reference LTC DWG # 05-08-1959 Rev A)
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LTM8026IY#PBF Details

  • Manufacturer Part Number:

    LTM8026IY#PBF

  • Brand Name:

    Analog Devices Inc

  • Pbfree Code:

    No

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    11.25 X 15 MM, 3.42 MM HEIGHT, ROHS COMPLIANT, MS-028, BGA-81

  • Pin Count:

    81

  • Manufacturer Package Code:

    05-08-1959

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    10

  • Additional Feature:

    OUTPUT VOLTAGE RANGE FROM 1.2 VOLT TO 24 VOLT

  • Analog IC - Other Type:

    SWITCHING REGULATOR

  • Control Mode:

    CURRENT-MODE

  • Control Technique:

    PULSE WIDTH MODULATION

  • Input Voltage-Max:

    36 V

  • Input Voltage-Min:

    6 V

  • Input Voltage-Nom:

    12 V

  • JESD-30 Code:

    R-PBGA-B81

  • Length:

    15 mm

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    1

  • Number of Terminals:

    81

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Current-Max:

    5 A

  • Output Voltage-Max:

    24 V

  • Output Voltage-Min:

    1.2 V

  • Output Voltage-Nom:

    3.3 V

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    BGA

  • Package Equivalence Code:

    BGA81,8X11,50

  • Package Shape:

    RECTANGULAR

  • Package Style:

    GRID ARRAY

  • Peak Reflow Temperature (Cel):

    245

  • Seated Height-Max:

    3.62 mm

  • Surface Mount:

    YES

  • Switcher Configuration:

    BUCK

  • Switching Frequency-Max:

    1000 kHz

  • Technology:

    HYBRID

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Form:

    BALL

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    11.25 mm

LTM8026IY#PBF Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a solid ground plane and thermal vias is recommended. The device should be placed near a thermal pad or heat sink to dissipate heat efficiently.
  • Use a soft-start circuit to limit the inrush current during start-up, and ensure a controlled shutdown sequence to prevent voltage spikes and oscillations.
  • Use a common-mode choke, X-capacitors, and Y-capacitors to filter out electromagnetic interference (EMI). Ensure that the layout is optimized to minimize loop areas and reduce radiation.
  • Use a low-noise, high-PSRR LDO regulator, and ensure that the input and output capacitors are selected for low equivalent series resistance (ESR) and high capacitance. Minimize the PCB layout's noise-sensitivity by keeping sensitive nodes away from noisy areas.
  • Ensure good thermal contact between the device and the heat sink, and use thermal interface materials (TIMs) to minimize thermal resistance. The heat sink should be designed to dissipate heat efficiently, and the PCB layout should allow for good airflow.

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LTM8026IY#PBF Overview

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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