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LTM8052EY#PBF - Analog Devices

Description: LINEAR TECHNOLOGY - LTM8052EY#PBF - DC/DC POL Converter, Adjustable, Buck, 1 MHz, 1.2 V to 24 V out, 5 A, BGA-81

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LTM8052EY#PBF - Analog Devices PCB footprint - BGA - BGA - LTM8026IY#PBF
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LTM8052EY#PBF - Analog Devices  - 3D model - BGA - LTM8026IY#PBF
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LTM8052EY#PBF Details

  • Manufacturer Part Number:

    LTM8052EY#PBF

  • Brand Name:

    Analog Devices Inc

  • Pbfree Code:

    No

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    11.25 X 15 MM, 3.42 MM HEIGHT, ROHS COMPLIANT, MS-028, BGA-81

  • Pin Count:

    81

  • Manufacturer Package Code:

    05-08-1959

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    8.5

  • Additional Feature:

    OUTPUT VOLTAGE RANGE FROM 1.2 VOLT TO 24 VOLT

  • Analog IC - Other Type:

    SWITCHING REGULATOR

  • Control Mode:

    CURRENT-MODE

  • Control Technique:

    PULSE WIDTH MODULATION

  • Input Voltage-Max:

    36 V

  • Input Voltage-Min:

    6 V

  • Input Voltage-Nom:

    12 V

  • JESD-30 Code:

    R-PBGA-B81

  • JESD-609 Code:

    e1

  • Length:

    15 mm

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    1

  • Number of Terminals:

    81

  • Operating Temperature-Max:

    125 °C

  • Output Current-Max:

    5 A

  • Output Voltage-Max:

    24 V

  • Output Voltage-Min:

    1.2 V

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    BGA

  • Package Equivalence Code:

    BGA81,8X11,50

  • Package Shape:

    RECTANGULAR

  • Package Style:

    GRID ARRAY

  • Seated Height-Max:

    3.62 mm

  • Surface Mount:

    YES

  • Switcher Configuration:

    BUCK

  • Switching Frequency-Max:

    1000 kHz

  • Technology:

    HYBRID

  • Temperature Grade:

    OTHER

  • Terminal Finish:

    Tin/Silver/Copper (Sn/Ag/Cu)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    BOTTOM

  • Width:

    11.25 mm

LTM8052EY#PBF Frequently Asked Questions (FAQs)

  • The recommended PCB layout for optimal thermal performance involves placing the device on a 2-layer or 4-layer board with a solid ground plane, using thermal vias to connect the exposed pad to the ground plane, and keeping the thermal path as short as possible.
  • To ensure reliable operation in high-temperature environments, it is recommended to follow proper thermal design and layout guidelines, use a heat sink if necessary, and consider derating the device's output current and voltage according to the temperature derating curves provided in the datasheet.
  • Using a lower input voltage than the recommended range may result in reduced output voltage and current, while using a higher input voltage may result in increased power dissipation and reduced reliability. It is recommended to operate the device within the specified input voltage range for optimal performance and reliability.
  • To troubleshoot issues with the device's output voltage or current, check the input voltage, output load, and PCB layout for any anomalies or deviations from the recommended design guidelines. Also, verify that the device is properly configured and that the output voltage and current are within the specified ranges.
  • The LTM8052EY#PBF is designed to meet CISPR 22 Class B EMI standards, but proper PCB layout and design practices, such as using a solid ground plane, minimizing loop areas, and using EMI filters, are still necessary to ensure compliance with EMI and RFI regulations.

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LTM8052EY#PBF Overview

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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