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LTM8057EY#PBF - Analog Devices

Description: 3.1VIN to 31VIN Isolated μModule (Power Module) DC/DC Converter

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LTM8057EY#PBF - Analog Devices PCB footprint - BGA - BGA - BGA Package 38-Lead (11.25mm × 9.00mm × 4.92mm)
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LTM8057EY#PBF - Analog Devices  - 3D model - BGA - BGA Package 38-Lead (11.25mm × 9.00mm × 4.92mm)
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LTM8057EY#PBF Details

  • Manufacturer Part Number:

    LTM8057EY#PBF

  • Brand Name:

    Analog Devices Inc

  • Pbfree Code:

    No

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    BGA-38

  • Pin Count:

    38

  • Manufacturer Package Code:

    05-08-1925

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    10

  • Additional Feature:

    OUTPUT VOLTAGE RANGE FROM 2.5 VOLT TO 12 VOLT

  • Analog IC - Other Type:

    SWITCHING REGULATOR

  • Control Mode:

    CURRENT-MODE

  • Control Technique:

    VARIABLE FREQUENCY

  • Input Voltage-Max:

    31 V

  • Input Voltage-Min:

    3.1 V

  • Input Voltage-Nom:

    12 V

  • JESD-30 Code:

    R-PBGA-B38

  • JESD-609 Code:

    e1

  • Length:

    11.25 mm

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    1

  • Number of Terminals:

    38

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Current-Max:

    0.44 A

  • Output Voltage-Max:

    12 V

  • Output Voltage-Min:

    2.5 V

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    BGA

  • Package Shape:

    RECTANGULAR

  • Package Style:

    GRID ARRAY

  • Seated Height-Max:

    5.12 mm

  • Surface Mount:

    YES

  • Switcher Configuration:

    BUCK

  • Technology:

    HYBRID

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Tin/Silver/Copper (Sn/Ag/Cu)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    BOTTOM

  • Width:

    9 mm

LTM8057EY#PBF Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a solid ground plane and thermal vias is recommended. The device should be placed near a thermal pad or heat sink to dissipate heat efficiently.
  • Use a soft-start circuit to limit the inrush current during start-up, and ensure a controlled shutdown sequence to prevent voltage spikes and oscillations.
  • Use a combination of X-capacitors, Y-capacitors, and common-mode chokes to filter out electromagnetic interference (EMI). Ensure that the filter components are placed close to the device and connected to a solid ground plane.
  • Use a low-noise, high-PSRR LDO regulator, and ensure that the input and output capacitors are of high quality and placed close to the device. Also, use a shielded inductor and a low-ESR output capacitor to minimize noise and voltage ripple.
  • Ensure good thermal contact between the device and the heat sink, and use a thermal interface material (TIM) to fill any gaps. The heat sink should be designed to dissipate heat efficiently, and the device should be placed in a well-ventilated area to prevent overheating.

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LTM8057EY#PBF Overview

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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