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LTM8080EY#PBF - Analog Devices

Description: 40VIN, Dual 500mA or Single 1A Ultralow Noise, Ultrahigh PSRR μModule Regulator

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Symbol
LTM8080EY#PBF - Analog Devices - PCB symbol
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PCB Footprints
LTM8080EY#PBF - Analog Devices PCB footprint - BGA - BGA - 48-Ball Chip Scale Package Ball Grid Array [CSP_BGA] 9mm × 6.25mm × 3.32mm (Reference DWG # 05-08-1999)
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3D Models
LTM8080EY#PBF - Analog Devices - 3D model - BGA - 48-Ball Chip Scale Package Ball Grid Array [CSP_BGA] 9mm × 6.25mm × 3.32mm (Reference DWG # 05-08-1999)
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LTM8080EY#PBF Details

  • Manufacturer Part Number:

    LTM8080EY#PBF

  • Brand Name:

    Analog Devices Inc

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    CHIP SCALE BGA

  • Package Description:

    BGA-48

  • Pin Count:

    48

  • Manufacturer Package Code:

    CHIP SCALE BGA

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Date Of Intro:

    2022-12-23

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    9

  • Adjustability:

    ADJUSTABLE

  • JESD-30 Code:

    R-PBGA-B48

  • JESD-609 Code:

    e1

  • Length:

    9 mm

  • Load Regulation-Max(%):

    0.00625%

  • Moisture Sensitivity Level:

    4

  • Number of Functions:

    1

  • Number of Outputs:

    2

  • Number of Terminals:

    48

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Current1-Max:

    0.5 A

  • Output Current2-Max:

    0.5 A

  • Output Voltage1-Max:

    8 V

  • Output Voltage2-Max:

    8 V

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    BGA

  • Package Equivalence Code:

    BGA48,8X6,39

  • Package Shape:

    RECTANGULAR

  • Package Style:

    GRID ARRAY

  • Peak Reflow Temperature (Cel):

    260

  • Regulator Type:

    ADJUSTABLE POSITIVE MULTIPLE OUTPUT LDO REGULATOR

  • Seated Height-Max:

    3.52 mm

  • Surface Mount:

    YES

  • Technology:

    HYBRID

  • Terminal Finish:

    Tin/Silver/Copper (Sn/Ag/Cu)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    1 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    6.25 mm

LTM8080EY#PBF Frequently Asked Questions (FAQs)

  • The recommended PCB layout for optimal thermal performance involves placing the device on a 2-layer or 4-layer board with a solid ground plane on the bottom layer, and using thermal vias to connect the exposed pad to the ground plane. Additionally, keeping the thermal path short and using a heat sink can help to improve thermal performance.
  • To ensure reliable start-up and shutdown of the LTM8080EY, it is recommended to follow a controlled power-up and power-down sequence, with a minimum rise time of 10ms and a maximum fall time of 10ms. Additionally, using a soft-start circuit can help to reduce inrush current and prevent voltage overshoot.
  • Operating the LTM8080EY beyond the recommended operating conditions can lead to reduced reliability, decreased performance, and potentially even device failure. It is essential to ensure that the device is operated within the recommended voltage, current, and temperature ranges to ensure optimal performance and reliability.
  • To troubleshoot issues with the LTM8080EY's output voltage regulation, check the input voltage, output voltage, and feedback resistors for correct values and connections. Also, verify that the device is properly configured and that the output capacitor is suitable for the application. If issues persist, consult the datasheet and application notes for further guidance.
  • The LTM8080EY is designed to meet EMI and RFI requirements, but it is still essential to follow proper PCB layout and design practices to minimize electromagnetic interference. This includes using a solid ground plane, keeping signal traces short, and using shielding and filtering components as needed.

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LTM8080EY#PBF Overview

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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