ROHM recommends a PCB layout with a thermal pad connected to a large copper area on the bottom layer, and multiple vias to dissipate heat efficiently. A minimum of 2oz copper thickness is recommended.
To ensure reliable operation in high-temperature environments, it is recommended to derate the power dissipation according to the temperature derating curve provided in the datasheet. Additionally, ensure good thermal design and heat sinking to keep the junction temperature below 150°C.
ROHM recommends a soldering profile with a peak temperature of 260°C, a dwell time of 10-30 seconds, and a cooling rate of 3-5°C/s. It is also recommended to use a solder with a melting point above 217°C.
Yes, the LTR100JZPFLR200 is qualified for automotive and high-reliability applications. It meets the requirements of AEC-Q101 and is designed to operate in harsh environments. However, it is recommended to consult with ROHM's application engineers to ensure the component meets the specific requirements of your application.
To prevent damage, it is recommended to store the components in their original packaging, away from direct sunlight and moisture. During shipping, ensure the components are properly secured and protected from mechanical stress and vibration.
Trust Checks
No trust score is available for this model.
Trust Score Unavailable
Sponsored
LTR100JZPFLR200 Overview
Use the download button to access the LTR100JZPFLR200 3D model. You can still request or build the schematic symbol and PCB footprint by using the respective build or request forms on this page.
To find more CAD model downloads similar to this part, try a partial part number search, like LTR10,
or try a keyword search, such as Fixed Resistors
