ROHM recommends a thermal pad size of at least 2mm x 2mm, with multiple vias to the ground plane to ensure good heat dissipation. A thermal resistance of less than 10°C/W is achievable with a well-designed PCB layout.
To ensure reliable operation in high-temperature environments, it is recommended to derate the power dissipation according to the temperature derating curve provided in the datasheet. Additionally, ensure good thermal design and consider using a heat sink if necessary.
ROHM recommends a soldering profile with a peak temperature of 260°C, a dwell time of 10-30 seconds, and a ramp-up rate of 3°C/s. It is also recommended to use a solder with a melting point of 217°C or higher.
The LTR100JZPFLR300 is not suitable for use in high-humidity environments without proper protection. ROHM recommends using a moisture-resistant coating or conformal coating to prevent moisture ingress.
ROHM recommends storing the LTR100JZPFLR300 in a dry, cool place with a relative humidity of 60% or less, and a temperature range of -10°C to 30°C. Avoid storing the component in direct sunlight or near heat sources.
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