LTR100JZPJ471 footprint, schematic symbol and 3D model by ROHM Semiconductor

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LTR100JZPJ471 Details

ROHM recommends a PCB layout with a thermal pad connected to a large copper area on the bottom layer, and multiple vias to dissipate heat efficiently. A minimum of 2oz copper thickness is recommended.
To ensure reliability, follow the recommended derating curves for power dissipation vs. temperature, and consider using a heat sink or thermal interface material to reduce the junction temperature. Also, ensure that the device is operated within the recommended operating conditions.
ROHM recommends a soldering profile with a peak temperature of 260°C, a dwell time of 10-30 seconds, and a cooling rate of 4°C/s or less. It's also important to follow the recommended soldering conditions and handling precautions to prevent damage.
The LTR100JZPJ471 is not designed for use in high-humidity environments. If you need to use the device in a humid environment, consider using a moisture-resistant coating or conformal coating to protect the device. However, this may still not guarantee reliable operation.
ROHM recommends storing the device in a dry, cool place with a temperature range of 5°C to 30°C and a relative humidity of 60% or less. Avoid storing the device in direct sunlight or near heat sources.

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