ROHM recommends a PCB layout with a thermal pad connected to a large copper area on the bottom layer, and multiple vias to dissipate heat efficiently. A minimum of 2oz copper thickness is recommended.
ROHM recommends using a heat sink or thermal interface material to reduce the junction temperature. Additionally, ensure that the device is operated within the recommended operating temperature range and derate the power dissipation accordingly.
ROHM recommends a soldering profile with a peak temperature of 260°C, a dwell time of 10-30 seconds, and a ramp-up rate of 3°C/s. Refer to the ROHM soldering guidelines for more information.
Yes, the LTR100LJZPFSR051 is rated for operation in humid environments. However, ROHM recommends using a moisture-resistant coating or conformal coating to prevent moisture ingress.
ROHM recommends using a low-ESR ceramic capacitor with a value of 10uF to 22uF, and a voltage rating of 50V or higher. The capacitor should be placed as close to the device as possible.
Trust Checks
No trust score is available for this model.
Trust Score Unavailable
Sponsored
LTR100LJZPFSR051 Overview
Use the download button to access the LTR100LJZPFSR051 3D model. You can still request or build the schematic symbol and PCB footprint by using the respective build or request forms on this page.
To find more CAD model downloads similar to this part, try a partial part number search, like LTR10,
or try a keyword search, such as Fixed Resistors
