LTR10EZPJ100 footprint, schematic symbol and 3D model by ROHM Semiconductor

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LTR10EZPJ100 Details

ROHM recommends a PCB layout with a thermal pad connected to a large copper area on the bottom layer, and multiple vias to dissipate heat efficiently. A minimum of 2oz copper thickness is recommended.
To ensure reliable operation in high-temperature environments, it is recommended to derate the power dissipation according to the temperature derating curve provided in the datasheet. Additionally, ensure good thermal design and heat sinking to keep the junction temperature below 150°C.
ROHM recommends a soldering profile with a peak temperature of 260°C, a dwell time of 10-30 seconds, and a cooling rate of 4°C/s or less to prevent thermal shock.
Yes, the LTR10EZPJ100 is designed to withstand vibrations up to 10G. However, it is recommended to ensure that the component is properly secured to the PCB and that the PCB is designed to withstand the expected vibration levels.
ROHM recommends storing the LTR10EZPJ100 in a dry, cool place with a temperature range of 5°C to 30°C and humidity below 60%. Avoid storing the component in direct sunlight or near heat sources.

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