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LTR18EZPFLR200 - ROHM Semiconductor

Description: 1632(0612)Size, High Power Low Ohmic Chip Resistor <Wide Terminal Type> (AEC-Q200 Qualified)

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LTR18EZPFLR200 Details

  • Manufacturer Part Number:

    LTR18EZPFLR200

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    CHIP

  • Reach Compliance Code:

    Compliant

  • Country Of Origin:

    Philippines, Thailand

  • ECCN Code:

    EAR99

  • HTS Code:

    8533.21.00.30

  • Factory Lead Time:

    13 Weeks

  • Manufacturer:

    ROHM Semiconductor

  • YTEOL:

    9

  • Construction:

    Rectangular

  • JESD-609 Code:

    e3

  • Mounting Feature:

    SURFACE MOUNT

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    155 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Height:

    0.58 mm

  • Package Length:

    1.6 mm

  • Package Style:

    SMT

  • Package Width:

    3.2 mm

  • Packing Method:

    TR, Paper, 7 Inch

  • Rated Power Dissipation (P):

    1.5 W

  • Rated Temperature:

    70 °C

  • Reference Standard:

    AEC-Q200; IEC; IATF16949

  • Resistance:

    0.2 Ω

  • Resistor Type:

    FIXED RESISTOR

  • Size Code:

    0612

  • Surface Mount:

    YES

  • Technology:

    METAL GLAZE/THICK FILM

  • Temperature Coefficient:

    0,150 ppm/°C

  • Terminal Finish:

    Tin (Sn) - with Nickel (Ni) barrier

  • Terminal Shape:

    WRAPAROUND

  • Tolerance:

    1%

LTR18EZPFLR200 Frequently Asked Questions (FAQs)

  • A thermal pad on the bottom of the package should be connected to a large copper area on the PCB to dissipate heat efficiently. A minimum of 2oz copper thickness is recommended.
  • Monitor the junction temperature (Tj) and ensure it stays below the maximum rating of 150°C. Also, ensure the input voltage (Vin) is within the recommended range of 2.5V to 5.5V.
  • A 10uF to 22uF X5R or X7R ceramic capacitor is recommended for input decoupling, placed as close to the device as possible.
  • Use a shielded enclosure, keep the device away from antennas and other EMI sources, and ensure good PCB layout practices such as separating analog and digital grounds.
  • The device has a soft-start feature that limits the inrush current during power-up. During power-down, the device enters a low-power state to minimize power consumption.

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