LTR18EZPJ300 footprint, schematic symbol and 3D model by ROHM Semiconductor

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LTR18EZPJ300 Details

ROHM recommends a PCB layout with a thermal pad connected to a large copper area on the bottom layer, and multiple vias to dissipate heat efficiently. A minimum of 2oz copper thickness is recommended.
To ensure reliability, follow the recommended operating temperature range, use a suitable thermal interface material, and implement a robust thermal management system. Also, consider derating the device's power dissipation according to the ambient temperature.
ROHM recommends a soldering profile with a peak temperature of 260°C, a dwell time above 240°C of 30-60 seconds, and a cooling rate of 3-5°C/s. Refer to the ROHM soldering guidelines for more details.
The LTR18EZPJ300 is not designed for use in high-humidity environments. If you need to operate the device in humid conditions, consider using a moisture-resistant coating or conformal coating to protect the device.
Store the LTR18EZPJ300 in a dry, cool place with a temperature range of 5°C to 30°C and a relative humidity of 60% or less. Avoid storing the device in direct sunlight or near heat sources.

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