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LV52117QATXG - onsemi

Description: ON SEMICONDUCTOR - LV52117QATXG - DC/DC Switching Regulator, Inverting, 2 Output, up to 4.6 V in, 5.8 V/0.1 A out, 1.74 MHz, TDFN-12

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LV52117QATXG - onsemi PCB footprint - Small Outline No-lead - Small Outline No-lead - TDFN12 3X3 CASE 511AN-01
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LV52117QATXG - onsemi  - 3D model - Small Outline No-lead - TDFN12 3X3 CASE 511AN-01
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LV52117QATXG Details

  • Manufacturer Part Number:

    LV52117QATXG

  • Brand Name:

    ON Semiconductor

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Package Description:

    TDFN-12

  • Manufacturer Package Code:

    511AN

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Manufacturer:

    onsemi

  • YTEOL:

    0

  • Analog IC - Other Type:

    DUAL SWITCHING CONTROLLER

  • Control Mode:

    CURRENT-MODE

  • Input Voltage-Max:

    4.6 V

  • Input Voltage-Min:

    2.75 V

  • Input Voltage-Nom:

    3.7 V

  • JESD-30 Code:

    S-PDSO-N12

  • Length:

    3 mm

  • Number of Functions:

    1

  • Number of Terminals:

    12

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -30 °C

  • Output Current-Max:

    0.1 A

  • Output Voltage-Max:

    5.8 V

  • Output Voltage-Min:

    4.6 V

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HVSON

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

  • Seated Height-Max:

    0.8 mm

  • Surface Mount:

    YES

  • Switching Frequency-Max:

    1740 kHz

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.45 mm

  • Terminal Position:

    DUAL

  • Width:

    3 mm

LV52117QATXG Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a solid ground plane and thermal vias is recommended. Ensure that the thermal pad is connected to a large copper area to dissipate heat efficiently.
  • Implement a robust power-on reset circuit, ensure a stable input voltage, and follow the recommended operating conditions. Also, consider using a thermistor or thermocouple to monitor the device temperature.
  • Use a shielded enclosure, ensure proper grounding, and follow good PCB layout practices. Implement EMI filters on the input and output lines, and consider using a common-mode choke to reduce emissions.
  • Use a combination of capacitors with different values and types (e.g., ceramic, electrolytic, and film) to achieve a low-ESR output filter. Ensure the filter components are placed close to the output pins to minimize parasitic inductance.
  • Monitor the output voltage, current, and temperature during production testing. Verify the device's functionality, including the enable pin, soft-start, and overcurrent protection.

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LV52117QATXG Overview

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