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LV58063MC-AH - onsemi

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LV58063MC-AH - onsemi PCB footprint - Small Outline Packages - Small Outline Packages - SOP8L(2000MIL) CASE 751DM
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LV58063MC-AH - onsemi  - 3D model - Small Outline Packages - SOP8L(2000MIL) CASE 751DM
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LV58063MC-AH Details

  • Manufacturer Part Number:

    LV58063MC-AH

  • Brand Name:

    ON Semiconductor

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Package Description:

    0.200 INCH, HALOGEN AND LEAD FREE, SOP-8

  • Pin Count:

    8

  • Manufacturer Package Code:

    751DM

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    4 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    0

  • Analog IC - Other Type:

    SWITCHING REGULATOR

  • Control Mode:

    CURRENT-MODE

  • Control Technique:

    PULSE WIDTH MODULATION

  • Input Voltage-Max:

    28 V

  • Input Voltage-Min:

    8 V

  • Input Voltage-Nom:

    12 V

  • JESD-30 Code:

    R-PDSO-G8

  • JESD-609 Code:

    e3

  • Length:

    4.93 mm

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    80 °C

  • Operating Temperature-Min:

    -20 °C

  • Output Current-Max:

    3 A

  • Output Voltage-Min:

    0.8 V

  • Output Voltage-Nom:

    5 V

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HLSOP

  • Package Equivalence Code:

    SOP8,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, HEAT SINK/SLUG, LOW PROFILE

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.68 mm

  • Supply Current-Max (Isup):

    5 mA

  • Surface Mount:

    YES

  • Switcher Configuration:

    BUCK

  • Switching Frequency-Max:

    444 kHz

  • Technology:

    BICMOS

  • Temperature Grade:

    COMMERCIAL EXTENDED

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Width:

    3.94 mm

LV58063MC-AH Frequently Asked Questions (FAQs)

  • A 2-layer or 4-layer PCB with a solid ground plane and thermal vias is recommended. Ensure a minimum of 1 oz copper thickness and a thermal relief pattern around the device.
  • Implement a robust thermal management system, including a heat sink, thermal interface material, and a cooling fan if necessary. Monitor the device's junction temperature and adjust the system design accordingly.
  • Use low-ESR capacitors with a minimum capacitance of 10uF for the input and 22uF for the output. Ensure the capacitors are rated for the maximum operating voltage and have a low equivalent series resistance (ESR).
  • Use a shielded enclosure, keep the device and its components away from the PCB edge, and implement a multi-layer PCB with a solid ground plane. Ensure proper filtering and decoupling of the input and output lines.
  • Apply the input voltage first, followed by the enable signal. Ensure the input voltage is stable before applying the enable signal. A soft-start circuit can be implemented to reduce inrush current.

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LV58063MC-AH Overview

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Part Image LV58063MCZ-AH onsemi

Switching Regulator, Current-mode, 3A, 444kHz Switching Freq-Max, BICMOS, PDSO8