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LV8400V-TLM-E - onsemi

Description: ON Semiconductor LV8400V-TLM-E, Full Bridge Motor Driver Bidirectional Motor, 16-Pin SSOP

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LV8400V-TLM-E - onsemi PCB footprint - Small Outline Packages - Small Outline Packages - SSOP16
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LV8400V-TLM-E - onsemi  - 3D model - Small Outline Packages - SSOP16
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LV8400V-TLM-E Details

  • Manufacturer Part Number:

    LV8400V-TLM-E

  • Brand Name:

    ON Semiconductor

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    SOIC

  • Package Description:

    0.225 INCH, LEAD FREE, SSOP-16

  • Pin Count:

    16

  • Manufacturer Package Code:

    565AM

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    4 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    0

  • Analog IC - Other Type:

    3-PHASE BRUSHLESS DC MOTOR CONTROLLER

  • JESD-30 Code:

    R-PDSO-G16

  • JESD-609 Code:

    e6

  • Length:

    5.2 mm

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    1

  • Number of Terminals:

    16

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -20 °C

  • Output Current-Max:

    3.8 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    LSSOP

  • Package Equivalence Code:

    SSOP16,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    1.5 mm

  • Supply Voltage-Max (Vsup):

    5.5 V

  • Supply Voltage-Min (Vsup):

    2.7 V

  • Supply Voltage-Nom (Vsup):

    5 V

  • Surface Mount:

    YES

  • Technology:

    BICMOS

  • Temperature Grade:

    OTHER

  • Terminal Finish:

    Tin/Bismuth (Sn/Bi)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    4.4 mm

LV8400V-TLM-E Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a solid ground plane and a separate power plane is recommended. Keep the input and output traces short and away from noise sources. Use a common mode choke or a ferrite bead to filter the input power.
  • Ensure good thermal management by providing adequate heat sinking and airflow. Use a thermal interface material (TIM) between the device and the heat sink. Monitor the junction temperature (TJ) and ensure it stays within the recommended range.
  • A low-ESR ceramic capacitor with a value of 10uF to 22uF is recommended. The capacitor should be placed close to the VIN pin and have a voltage rating of at least 25V.
  • Use an oscilloscope to monitor the input and output voltages, and check for any signs of oscillation or noise. Verify that the input voltage is within the recommended range and that the device is properly heatsinked. Check the PCB layout for any signs of noise coupling or electromagnetic interference (EMI).
  • Yes, the LV8400V-TLM-E can be used in a redundant or parallel configuration to achieve higher power output. However, ensure that the devices are properly synchronized and that the output voltages are matched to prevent current imbalance.

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