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LV8498CT-TE-L-H - onsemi

Description: Motor / Motion / Ignition Controllers & Drivers MOTOR DRIVER

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Symbol
LV8498CT-TE-L-H - onsemi - PCB symbol
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PCB Footprints
LV8498CT-TE-L-H - onsemi PCB footprint - BGA - BGA - WLCSP6 1.27x0.87 / WLP6K
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3D Models
LV8498CT-TE-L-H - onsemi - 3D model - BGA - WLCSP6 1.27x0.87 / WLP6K
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LV8498CT-TE-L-H Details

  • Manufacturer Part Number:

    LV8498CT-TE-L-H

  • Brand Name:

    ON Semiconductor

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Package Description:

    1.27 X 0.87 MM, 0.25 MM HEIGHT, WLP-6

  • Pin Count:

    6

  • Manufacturer Package Code:

    567ES

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    4 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    0

  • Analog IC - Other Type:

    VOICE COIL MOTOR CONTROLLER

  • JESD-30 Code:

    R-PBGA-B6

  • JESD-609 Code:

    e1

  • Length:

    1.27 mm

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    6

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -30 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    VFBGA

  • Package Equivalence Code:

    BGA6,2X3,16

  • Package Shape:

    RECTANGULAR

  • Package Style:

    GRID ARRAY, VERY THIN PROFILE, FINE PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    0.33 mm

  • Supply Current-Max (Isup):

    3 mA

  • Supply Voltage-Max (Vsup):

    5 V

  • Supply Voltage-Min (Vsup):

    2.2 V

  • Supply Voltage-Nom (Vsup):

    2.8 V

  • Surface Mount:

    YES

  • Technology:

    BICMOS

  • Temperature Grade:

    OTHER

  • Terminal Finish:

    Tin/Silver/Copper (Sn/Ag/Cu)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.4 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    0.87 mm

LV8498CT-TE-L-H Frequently Asked Questions (FAQs)

  • For optimal thermal performance, it is recommended to use a 2-layer or 4-layer PCB with a solid ground plane and a thermal relief pattern under the IC. The datasheet provides a recommended PCB layout, but it's essential to consult with onsemi's application notes and thermal modeling tools for specific guidance.
  • To ensure reliable operation in high-temperature environments, it's crucial to follow the recommended operating conditions, including the maximum junction temperature (Tj) of 150°C. Additionally, consider using thermal management techniques such as heat sinks, thermal interfaces, and airflow management. Consult onsemi's application notes and thermal modeling tools for specific guidance.
  • The recommended input capacitor value and type depend on the specific application and operating conditions. As a general guideline, a 10uF to 22uF X7R or X5R ceramic capacitor is recommended. However, it's essential to consult onsemi's application notes and capacitor selection guides for specific guidance.
  • To minimize EMI in your design, follow best practices for PCB layout, component placement, and shielding. Use a solid ground plane, keep sensitive traces away from noisy components, and consider using EMI filters or shielding cans. Consult onsemi's application notes and EMI mitigation guides for specific guidance.
  • The recommended output capacitor value and type depend on the specific application and operating conditions. As a general guideline, a 10uF to 22uF X7R or X5R ceramic capacitor is recommended. However, it's essential to consult onsemi's application notes and capacitor selection guides for specific guidance.

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LV8498CT-TE-L-H Overview

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