LVM25FVR025E-TR - Ohmite

LVM25FVR025E-TR Frequently Asked Questions (FAQs)

• What is the recommended PCB footprint for LVM25FVR025E-TR?
  The recommended PCB footprint for LVM25FVR025E-TR is a rectangular pad with dimensions of 0.25 inches (6.4 mm) x 0.15 inches (3.8 mm) with a 0.05 inches (1.3 mm) radius corner. It's essential to follow the manufacturer's recommended footprint to ensure proper thermal performance and to prevent overheating.
• Can I use LVM25FVR025E-TR in a high-vibration environment?
  Yes, LVM25FVR025E-TR is designed to withstand high-vibration environments. Ohmite Mfg Co specifies that the device can operate in environments with vibrations up to 10 G peak acceleration. However, it's crucial to ensure that the device is properly mounted and secured to the PCB to prevent damage or detachment.
• How do I handle the thermal interface material (TIM) for LVM25FVR025E-TR?
  The thermal interface material (TIM) for LVM25FVR025E-TR is a critical component for heat dissipation. Ohmite Mfg Co recommends using a TIM with a thermal conductivity of at least 1.5 W/m-K. Apply a thin, even layer of TIM to the device's thermal pad, and ensure that the TIM is compatible with the device's operating temperature range.
• What is the maximum allowable temperature for LVM25FVR025E-TR?
  The maximum allowable temperature for LVM25FVR025E-TR is 150°C. Exceeding this temperature can cause permanent damage to the device. Ensure that the device operates within the recommended temperature range to maintain its performance and lifespan.
• Can I use LVM25FVR025E-TR in a humid environment?
  LVM25FVR025E-TR is designed to operate in environments with relative humidity up to 95%. However, it's essential to ensure that the device is properly sealed and protected from moisture ingress to prevent corrosion or damage. Follow the manufacturer's guidelines for humidity protection and sealing.