LX2082RE82029B - NXP

LX2082RE82029B Details

• Manufacturer Part Number:

  LX2082RE82029B

• Rohs Code:

  Yes

• Part Life Cycle Code:

  Active

• Package Description:

  FCBGA-1150

• ECCN Code:

  5A002.A.1

• HTS Code:

  8542.31.00.01

• Manufacturer:

  NXP Semiconductors

• JESD-30 Code:

  S-PBGA-B1150

• Length:

  23 mm

• Moisture Sensitivity Level:

  3

• Number of Terminals:

  1150

• Operating Temperature-Max:

  105 °C

• Operating Temperature-Min:

  5 °C

• Package Body Material:

  PLASTIC/EPOXY

• Package Code:

  FBGA

• Package Equivalence Code:

  BGA1150,48X48,25

• Package Shape:

  SQUARE

• Package Style:

  GRID ARRAY, FINE PITCH

• Peak Reflow Temperature (Cel):

  250

• Seated Height-Max:

  2.17 mm

• Supply Voltage-Max:

  0.88 V

• Supply Voltage-Min:

  0.82 V

• Supply Voltage-Nom:

  0.85 V

• Surface Mount:

  YES

• Technology:

  CMOS

• Terminal Form:

  BALL

• Terminal Pitch:

  0.65 mm

• Terminal Position:

  BOTTOM

• Time@Peak Reflow Temperature-Max (s):

  30

• Width:

  23 mm

• uPs/uCs/Peripheral ICs Type:

  SoC