M1AFS250-1FGG256 - Microchip

M1AFS250-1FGG256 Details

• Manufacturer Part Number:

  M1AFS250-1FGG256

• Rohs Code:

  Yes

• Part Life Cycle Code:

  Active

• Package Description:

  FBGA-256

• Pin Count:

  256

• Manufacturer Package Code:

  LFBGA-256

• Country Of Origin:

  Malaysia

• HTS Code:

  8542.31.00.60

• Factory Lead Time:

  12 Weeks

• Manufacturer:

  Microchip Technology Inc

• YTEOL:

  23

• JESD-30 Code:

  S-PBGA-B256

• JESD-609 Code:

  e1

• Length:

  17 mm

• Moisture Sensitivity Level:

  3

• Number of CLBs:

  6144

• Number of Equivalent Gates:

  250000

• Number of Inputs:

  114

• Number of Outputs:

  114

• Number of Terminals:

  256

• Operating Temperature-Max:

  85 °C

• Organization:

  6144 CLBS, 250000 GATES

• Package Body Material:

  PLASTIC/EPOXY

• Package Code:

  LBGA

• Package Equivalence Code:

  BGA256,16X16,40

• Package Shape:

  SQUARE

• Package Style:

  GRID ARRAY, LOW PROFILE

• Packing Method:

  TRAY

• Peak Reflow Temperature (Cel):

  250

• Programmable Logic Type:

  FIELD PROGRAMMABLE GATE ARRAY

• Qualification Status:

  Not Qualified

• Seated Height-Max:

  1.68 mm

• Supply Voltage-Max:

  1.575 V

• Supply Voltage-Min:

  1.425 V

• Supply Voltage-Nom:

  1.5 V

• Surface Mount:

  YES

• Technology:

  CMOS, 130 nm

• Temperature Grade:

  OTHER

• Terminal Finish:

  Tin/Silver/Copper (Sn/Ag/Cu)

• Terminal Form:

  BALL

• Terminal Pitch:

  1 mm

• Terminal Position:

  BOTTOM

• Width:

  17 mm