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M2732AF1 - STMicroelectronics

Description: EPROM, 4K x 8, 24 Pin, Ceramic, DIP

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M2732AF1 - STMicroelectronics - PCB symbol
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M2732AF1 - STMicroelectronics PCB footprint - Dual-In-Line Packages - Dual-In-Line Packages - 24 pin Ceramic Dip
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M2732AF1 - STMicroelectronics - 3D model - Dual-In-Line Packages - 24 pin Ceramic Dip
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M2732AF1 Details

  • Manufacturer Part Number:

    M2732AF1

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    DIP

  • Package Description:

    WINDOWED, FRIT SEALED, CERAMIC, DIP-24

  • Pin Count:

    24

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.32.00.61

  • Manufacturer:

    STMicroelectronics

  • YTEOL:

    0

  • Access Time-Max:

    250 ns

  • Additional Feature:

    21V PROGRAMMING VOLTAGE

  • I/O Type:

    COMMON

  • JESD-30 Code:

    R-GDIP-T24

  • JESD-609 Code:

    e0

  • Length:

    31.75 mm

  • Memory Density:

    32768 bit

  • Memory IC Type:

    UVPROM

  • Memory Width:

    8

  • Number of Functions:

    1

  • Number of Terminals:

    24

  • Number of Words:

    4096 words

  • Number of Words Code:

    4000

  • Operating Mode:

    ASYNCHRONOUS

  • Operating Temperature-Max:

    70 °C

  • Organization:

    4KX8

  • Output Characteristics:

    3-STATE

  • Package Body Material:

    CERAMIC, GLASS-SEALED

  • Package Code:

    DIP

  • Package Equivalence Code:

    DIP24,.6

  • Package Shape:

    RECTANGULAR

  • Package Style:

    IN-LINE

  • Parallel/Serial:

    PARALLEL

  • Programming Voltage:

    21 V

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    5.715 mm

  • Supply Current-Max:

    0.125 mA

  • Supply Voltage-Max (Vsup):

    5.25 V

  • Supply Voltage-Min (Vsup):

    4.75 V

  • Supply Voltage-Nom (Vsup):

    5 V

  • Surface Mount:

    NO

  • Technology:

    NMOS

  • Temperature Grade:

    COMMERCIAL

  • Terminal Finish:

    TIN LEAD

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Pitch:

    2.54 mm

  • Terminal Position:

    DUAL

  • Width:

    15.24 mm

M2732AF1 Frequently Asked Questions (FAQs)

  • STMicroelectronics provides a recommended PCB layout in the application note AN2352, which includes guidelines for component placement, routing, and thermal management to ensure optimal performance and minimize electromagnetic interference (EMI).
  • The M2732AF1 has a thermal pad that must be connected to a thermal ground plane on the PCB to dissipate heat efficiently. A thermal interface material (TIM) can be used to improve heat transfer between the device and the heat sink or thermal ground plane.
  • The M2732AF1 has an operating temperature range of -40°C to 125°C, but the maximum junction temperature (TJ) should not exceed 150°C to ensure reliable operation and prevent damage to the device.
  • The M2732AF1's OTP memory can be programmed using the STMicroelectronics-provided programming software, such as the STVP-STM32 or the STM32CubeProgrammer, which allow you to configure the device's settings and parameters.
  • The M2732AF1 requires a specific power-up and power-down sequencing to ensure proper operation and prevent damage to the device. The recommended sequencing is outlined in the datasheet and application notes, and typically involves powering up the VCC supply before the VPP supply, and powering down the VPP supply before the VCC supply.

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M2732AF1 Overview

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About STMicroelectronics

STMicroelectronics (ST) is a global semiconductor company that designs, manufactures, and markets a broad range of integrated circuits (ICs), discrete devices, and other electronic components. STMicroelectronics offers a diverse portfolio of semiconductor products covering a wide range of applications and industries. Their product categories include microcontrollers, analog and mixed-signal ICs, MEMS (Micro-Electro-Mechanical Systems) sensors, power management ICs, RF (Radio Frequency) transceivers, aut

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