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M29F400FB55N3F2 - Alliance Memory

Description: NOR Flash NOR Flash(Micron) , PARALLEL, 4M , TSOP 48PIN, 55ns, -40-+125C, BOTTOM, Tape and Reel

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M29F400FB55N3F2 - Alliance Memory  - 3D model
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M29F400FB55N3F2 Details

  • Manufacturer Part Number:

    M29F400FB55N3F2

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    TSOP-48

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.32.00.51

  • Manufacturer:

    Alliance Memory Inc

  • YTEOL:

    4.2

  • Access Time-Max:

    55 ns

  • Alternate Memory Width:

    8

  • Boot Block:

    BOTTOM

  • Command User Interface:

    YES

  • Common Flash Interface:

    YES

  • Data Polling:

    YES

  • Data Retention Time-Min:

    20

  • Endurance:

    100000 Write/Erase Cycles

  • JESD-30 Code:

    R-PDSO-G48

  • Length:

    18.4 mm

  • Memory Density:

    4194304 bit

  • Memory IC Type:

    FLASH

  • Memory Width:

    16

  • Number of Functions:

    1

  • Number of Sectors/Size:

    1,2,1,7

  • Number of Terminals:

    48

  • Number of Words:

    262144 words

  • Number of Words Code:

    256000

  • Operating Mode:

    ASYNCHRONOUS

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Organization:

    256KX16

  • Output Characteristics:

    3-STATE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Equivalence Code:

    TSSOP48,.8,20

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Parallel/Serial:

    PARALLEL

  • Programming Voltage:

    5 V

  • Ready/Busy:

    YES

  • Screening Level:

    AEC-Q100

  • Seated Height-Max:

    1.2 mm

  • Sector Size:

    16K,8K,32K,64K

  • Standby Current-Max:

    0.00012 A

  • Supply Current-Max:

    0.03 mA

  • Supply Voltage-Max (Vsup):

    5.5 V

  • Supply Voltage-Min (Vsup):

    4.5 V

  • Supply Voltage-Nom (Vsup):

    5 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    DUAL

  • Toggle Bit:

    YES

  • Type:

    NOR TYPE

  • Width:

    12 mm

M29F400FB55N3F2 Frequently Asked Questions (FAQs)

  • The M29F400FB55N3F2 has an operating temperature range of -40°C to 85°C.
  • The device requires a controlled power-up and power-down sequence to prevent latch-up and ensure proper operation. A slow ramp-up of the power supply voltage (VCC) is recommended, and the device should be powered down in the following sequence: VCC, then VPP, then OE#.
  • The OE# pin should be tied to VCC or driven by a logic signal to enable or disable the output buffers. Leaving OE# floating can cause unpredictable behavior.
  • To avoid bus contention, ensure that the device is not driven by external signals during read and write operations. Use the Chip Enable (CE#) and Output Enable (OE#) pins to control access to the device.
  • The device can be erased using the Chip Erase command (60h) or Sector Erase command (50h). The erase operation should be performed in a controlled environment, and the device should be in the erased state before programming.

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M29F400FB55N3F2 Overview

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