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M2GL005-VF256 - Microsemi Corporation

Description: FPGA IGLOO®2 Family 6060 Cells 1.2V 256-Pin VFBGA Tray

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M2GL005-VF256 - Microsemi Corporation - PCB symbol
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M2GL005-VF256 - Microsemi Corporation PCB footprint - BGA - BGA - VF256
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3D Models
M2GL005-VF256 - Microsemi Corporation - 3D model - BGA - VF256
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M2GL005-VF256 Details

  • Manufacturer Part Number:

    M2GL005-VF256

  • Part Life Cycle Code:

    Transferred

  • Package Description:

    14 X 14 MM, 0.80 MM PITCH, VFBGA-256

  • HTS Code:

    8542.31.00.60

  • Manufacturer:

    Microsemi Corporation (now Microchip)

  • JESD-30 Code:

    S-PBGA-B256

  • Length:

    14 mm

  • Number of Terminals:

    256

  • Operating Temperature-Max:

    85 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    LFBGA

  • Package Equivalence Code:

    BGA256,16X16,32

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY, LOW PROFILE, FINE PITCH

  • Peak Reflow Temperature (Cel):

    240

  • Programmable Logic Type:

    FIELD PROGRAMMABLE GATE ARRAY

  • Seated Height-Max:

    1.56 mm

  • Supply Voltage-Max:

    1.26 V

  • Supply Voltage-Min:

    1.14 V

  • Supply Voltage-Nom:

    1.2 V

  • Surface Mount:

    YES

  • Temperature Grade:

    OTHER

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.8 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    20

  • Width:

    14 mm

M2GL005-VF256 Frequently Asked Questions (FAQs)

  • Microsemi provides a reference design guide for PCB layout and thermal management in the 'M2GL005-VF256 PCB Design and Package Guidelines' document. It's essential to follow these guidelines to ensure optimal performance and reliability.
  • Microsemi provides a Secure Boot and Firmware Encryption Guide for the M2GL005-VF256, which outlines the steps to implement secure boot and firmware encryption using the device's built-in security features and tools like Libero SoC and the Microsemi Secure Boot Utility.
  • While the M2GL005-VF256 is not specifically designed for high-reliability or radiation-hardened applications, Microsemi provides guidance on using the device in such environments through their 'M2GL005-VF256 Radiation and High-Reliability Application Notes' document. Engineers should carefully review this document to understand the limitations and necessary precautions.
  • Microsemi provides power management guidelines and recommendations in the 'M2GL005-VF256 Power Management Guide'. Engineers can optimize power consumption by using the device's power-saving features, such as clock gating and dynamic voltage and frequency scaling, and by implementing efficient power management techniques in their design.
  • Microsemi offers a range of development tools and software support for the M2GL005-VF256, including the Libero SoC design software, the Microsemi SoftConsole SDK, and the PolarFire SoC FPGA Icicle Kit. Engineers can also leverage third-party tools and IP cores from the Microsemi Partner Network.

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M2GL005-VF256 Overview

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