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M2GL025-FCSG325I - Microchip

Description: IGLOO2 Field Programmable Gate Array (FPGA) IC 180 1130496 27696 325-TFBGA, FCBGA Voltage - Supply 1.14V ~ 2.625V Temperature -40°C ~ 100°C (TJ)

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M2GL025-FCSG325I - Microchip PCB footprint - BGA - BGA - FCS325 (11mm X 11mm)
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M2GL025-FCSG325I - Microchip  - 3D model - BGA - FCS325 (11mm X 11mm)
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M2GL025-FCSG325I Details

  • Manufacturer Part Number:

    M2GL025-FCSG325I

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    BGA, BGA325,21X21,20

  • Pin Count:

    325

  • Manufacturer Package Code:

    TFBGA-325

  • Reach Compliance Code:

    Compliant

  • Country Of Origin:

    Thailand, USA

  • HTS Code:

    8542.31.00.60

  • Factory Lead Time:

    14 Weeks

  • Manufacturer:

    Microchip Technology Inc

  • YTEOL:

    24

  • JESD-30 Code:

    S-PBGA-B325

  • Length:

    11 mm

  • Moisture Sensitivity Level:

    3

  • Number of Inputs:

    180

  • Number of Logic Cells:

    27696

  • Number of Outputs:

    180

  • Number of Terminals:

    325

  • Operating Temperature-Max:

    100 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    BGA

  • Package Equivalence Code:

    BGA325,21X21,20

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY

  • Packing Method:

    TRAY

  • Programmable Logic Type:

    FIELD PROGRAMMABLE GATE ARRAY

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.01 mm

  • Supply Voltage-Max:

    1.26 V

  • Supply Voltage-Min:

    1.14 V

  • Supply Voltage-Nom:

    1.2 V

  • Surface Mount:

    YES

  • Technology:

    CMOS, 65 nm

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    BOTTOM

  • Width:

    11 mm

M2GL025-FCSG325I Frequently Asked Questions (FAQs)

  • Microchip provides a PCB design guide for the M2GL025-FCSG325I, which recommends a multi-layer PCB with a solid ground plane, and careful routing of high-speed signals to minimize crosstalk and electromagnetic interference (EMI).
  • A POR circuit can be implemented using a voltage supervisor IC, such as the Microchip MCP112-300, which can detect the power supply voltage and generate a reset signal to the FPGA. The POR circuit should be designed to ensure a clean and reliable reset signal to the FPGA.
  • Best practices for configuring and using the FPGA's clock management resources include using the Clock Wizard tool to generate clock signals, using a single clock domain for each clock signal, and using clock enables and clock gating to minimize power consumption.
  • Optimizing power consumption and thermal performance can be achieved by using power-saving features such as clock gating, dynamic voltage and frequency scaling, and using the FPGA's built-in power management features. Additionally, thermal performance can be improved by using a heat sink and ensuring good airflow around the FPGA.
  • Recommended design practices for implementing reliable and high-speed interfaces include using differential signaling, using a common clock domain for all signals, and using signal integrity analysis tools to optimize signal routing and termination.

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M2GL025-FCSG325I Overview

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About Microchip

Microchip Technology Inc. is a leading manufacturer of microcontrollers and semiconductor devices for a wide range of applications in the aerospace, automotive, consumer electronics, industrial, and medical industries. Alongside a comprehensive product portfolio, Microchip Technology Inc. also provides easy-to-use development tools that enable engineers to create optimal designs quickly with minimal iterations to reduce risk while lowering total system costs to market. Headquartered in Chandler, Arizona, th

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