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M2GL025-VF256 - Microsemi Corporation

Description: FPGA IGLOO®2 Family 27696 Cells 1.2V 256-Pin VFBGA Tray

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M2GL025-VF256 - Microsemi Corporation PCB footprint - BGA - BGA - VF256
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M2GL025-VF256 - Microsemi Corporation  - 3D model - BGA - VF256
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M2GL025-VF256 Details

  • Manufacturer Part Number:

    M2GL025-VF256

  • Part Life Cycle Code:

    Transferred

  • Package Description:

    14 X 14 MM, 0.80 MM PITCH, VFBGA-256

  • HTS Code:

    8542.31.00.60

  • Manufacturer:

    Microsemi Corporation (now Microchip)

  • JESD-30 Code:

    S-PBGA-B256

  • Length:

    14 mm

  • Number of Terminals:

    256

  • Operating Temperature-Max:

    85 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    LFBGA

  • Package Equivalence Code:

    BGA256,16X16,32

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY, LOW PROFILE, FINE PITCH

  • Peak Reflow Temperature (Cel):

    240

  • Programmable Logic Type:

    FIELD PROGRAMMABLE GATE ARRAY

  • Seated Height-Max:

    1.56 mm

  • Supply Voltage-Max:

    1.26 V

  • Supply Voltage-Min:

    1.14 V

  • Supply Voltage-Nom:

    1.2 V

  • Surface Mount:

    YES

  • Temperature Grade:

    OTHER

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.8 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    20

  • Width:

    14 mm

M2GL025-VF256 Frequently Asked Questions (FAQs)

  • Microsemi provides a PCB design guide for the M2GL025-VF256, which recommends a 4-layer or 6-layer stackup with specific layer assignments and spacing. It's essential to follow this guide to ensure signal integrity and minimize electromagnetic interference (EMI).
  • Microsemi recommends using an external POR circuit with a voltage supervisor IC, such as the MIC803, to ensure a reliable power-on reset. The POR circuit should be designed to meet the FPGA's power-up sequencing requirements and provide a clean reset signal.
  • The M2GL025-VF256 has a thermal design power (TDP) of 1.5W, and it's essential to provide adequate thermal management to prevent overheating. This can be achieved through the use of heat sinks, thermal interfaces, and airflow management. Microsemi provides thermal modeling tools and guidelines to help with thermal design.
  • Microsemi provides a range of security features, including AES encryption, secure boot, and anti-tamper protection. Engineers can use these features to secure the FPGA's configuration and prevent unauthorized access or tampering. Additionally, secure key management and storage practices should be followed to protect sensitive data.
  • To achieve high-speed signal integrity, engineers should follow Microsemi's guidelines for I/O buffer selection, signal routing, and termination. This includes using differential signaling, controlling impedance, and minimizing signal reflections. Additionally, simulation tools, such as IBIS-AMI models, can be used to analyze and optimize signal integrity.

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M2GL025-VF256 Overview

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M2GL025-VF256 Alternates

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Part Image M2GL025VFG256I Microchip Technology Inc

Field Programmable Gate Array, 27696-Cell, PBGA256

Part Image M2GL025-VF256 Microchip Technology Inc

Field Programmable Gate Array, PBGA256

Part Image M2GL025-VF256I Microchip Technology Inc

Field Programmable Gate Array, 27696-Cell, PBGA256

Part Image M2GL025VFG256 Microchip Technology Inc

Field Programmable Gate Array, PBGA256

Part Image M2GL025-VF256I Microsemi Corporation (now Microchip)

Field Programmable Gate Array, PBGA256

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