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M2GL025-VFG256 - Microsemi Corporation

Description: IC FPGA 138 I/O 256FBGA

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M2GL025-VFG256 - Microsemi Corporation PCB footprint - BGA - BGA - VFBGA 256
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M2GL025-VFG256 - Microsemi Corporation  - 3D model - BGA - VFBGA 256
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M2GL025-VFG256 Details

  • Manufacturer Part Number:

    M2GL025-VFG256

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Transferred

  • Package Description:

    LFBGA, BGA256,16X16,32

  • Reach Compliance Code:

    Compliant

  • HTS Code:

    8542.31.00.60

  • Manufacturer:

    Microsemi Corporation (now Microchip)

  • JESD-30 Code:

    S-PBGA-B256

  • Length:

    14 mm

  • Moisture Sensitivity Level:

    3

  • Number of Terminals:

    256

  • Operating Temperature-Max:

    85 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    LFBGA

  • Package Equivalence Code:

    BGA256,16X16,32

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY, LOW PROFILE, FINE PITCH

  • Programmable Logic Type:

    FIELD PROGRAMMABLE GATE ARRAY

  • Seated Height-Max:

    1.56 mm

  • Supply Voltage-Max:

    1.26 V

  • Supply Voltage-Min:

    1.14 V

  • Supply Voltage-Nom:

    1.2 V

  • Surface Mount:

    YES

  • Temperature Grade:

    OTHER

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.8 mm

  • Terminal Position:

    BOTTOM

  • Width:

    14 mm

M2GL025-VFG256 Frequently Asked Questions (FAQs)

  • Microsemi provides a PCB design guide and layout recommendations in their documentation, including the 'M2GL025-VFG256 PCB Design Guide' and 'Microsemi FPGA PCB Design and Layout Guidelines'. It's essential to follow these guidelines to ensure signal integrity, reduce noise, and meet timing requirements.
  • To optimize power consumption, use the Microsemi Power Analyzer tool to estimate power consumption and identify areas for optimization. Implement power-saving techniques such as clock gating, voltage scaling, and dynamic voltage and frequency scaling. Additionally, use the FPGA's built-in power management features, such as the Power Management Controller (PMC).
  • To secure the FPGA's configuration and IP, use Microsemi's SecureFPGA technology, which provides features such as bitstream encryption, authentication, and access control. Implement secure boot mechanisms, use secure communication protocols, and protect sensitive data using encryption and secure key storage.
  • Use Microsemi's Libero SoC design software, which provides a comprehensive debug environment, including signal probing, waveform analysis, and logic analyzer tools. Implement debug interfaces, such as JTAG or UART, and use debugging techniques like print statements, assertions, and logging to identify and isolate issues.
  • The M2GL025-VFG256 FPGA has a maximum junction temperature of 100°C. Ensure proper thermal management by using a heat sink, thermal interface material, and a well-designed PCB with adequate thermal vias and heat dissipation paths. Monitor the FPGA's temperature using the on-chip thermal sensor and adjust the system design accordingly.

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M2GL025-VFG256 Overview

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