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M2GL025T-VFG400I - Microsemi Corporation

Description: FPGA IGLOO®2 Family 27696 Cells 1.2V 400-Pin VFBGA Tray

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M2GL025T-VFG400I - Microsemi Corporation PCB footprint - BGA - BGA - VF400_1
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3D Models
M2GL025T-VFG400I - Microsemi Corporation  - 3D model - BGA - VF400_1
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M2GL025T-VFG400I Details

  • Manufacturer Part Number:

    M2GL025T-VFG400I

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Transferred

  • Package Description:

    17 X 17 MM, 0.80 MM PITCH, ROHS COMPLIANT, VFBGA-400

  • HTS Code:

    8542.31.00.60

  • Manufacturer:

    Microsemi Corporation (now Microchip)

  • JESD-30 Code:

    S-PBGA-B400

  • Length:

    17 mm

  • Moisture Sensitivity Level:

    3

  • Number of Inputs:

    207

  • Number of Logic Cells:

    27696

  • Number of Outputs:

    207

  • Number of Terminals:

    400

  • Operating Temperature-Max:

    100 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    LFBGA

  • Package Equivalence Code:

    BGA400,20X20,32

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY, LOW PROFILE, FINE PITCH

  • Programmable Logic Type:

    FIELD PROGRAMMABLE GATE ARRAY

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.51 mm

  • Supply Voltage-Max:

    1.26 V

  • Supply Voltage-Min:

    1.14 V

  • Supply Voltage-Nom:

    1.2 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.8 mm

  • Terminal Position:

    BOTTOM

  • Width:

    17 mm

M2GL025T-VFG400I Frequently Asked Questions (FAQs)

  • Microsemi provides a PCB design guide for the M2GL025T-VFG400I, which recommends a 4-layer or 6-layer stackup with specific layer assignments and spacing. It's essential to follow these guidelines to ensure signal integrity and minimize electromagnetic interference (EMI).
  • Microsemi recommends using an external POR circuit with a voltage supervisor IC, such as the MIC803, to ensure a reliable power-on reset. The POR circuit should be designed to meet the FPGA's power-up sequencing requirements and provide a clean reset signal.
  • The M2GL025T-VFG400I has a thermal design power (TDP) of 2.5W. To manage thermal dissipation, use a heat sink with a thermal interface material, and ensure good airflow around the device. Follow Microsemi's thermal management guidelines for PCB design and component placement.
  • Use Microsemi's Libero SoC design software to optimize the clocking architecture. Implement a clock tree with a single, high-quality clock source, and use clock domain crossing (CDC) techniques to minimize jitter and skew. Additionally, follow Microsemi's guidelines for clock signal routing and termination.
  • The M2GL025T-VFG400I has built-in security features, including AES encryption, secure boot, and tamper detection. Implement these features using Microsemi's Libero SoC design software and the PolarFire SoC Security User Guide. Additionally, follow Microsemi's guidelines for secure coding practices and key management.

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M2GL025T-VFG400I Overview

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