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M2GL050-FCS325 - Microchip

Description: FPGA - Field Programmable Gate Array M2GL050-FCS325

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PCB Footprints
M2GL050-FCS325 - Microchip PCB footprint - BGA - BGA - MPF200T-FCSG325E
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3D Models
M2GL050-FCS325 - Microchip  - 3D model - BGA - MPF200T-FCSG325E
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M2GL050-FCS325 Details

  • Manufacturer Part Number:

    M2GL050-FCS325

  • Part Life Cycle Code:

    Active

  • Package Description:

    FCBGA-325

  • Pin Count:

    325

  • Manufacturer Package Code:

    TFBGA-325

  • Country Of Origin:

    South Korea

  • HTS Code:

    8542.31.00.60

  • Factory Lead Time:

    16 Weeks

  • Manufacturer:

    Microchip Technology Inc

  • YTEOL:

    23

  • JESD-30 Code:

    S-PBGA-B325

  • JESD-609 Code:

    e0

  • Length:

    11 mm

  • Number of Inputs:

    200

  • Number of Logic Cells:

    56340

  • Number of Outputs:

    200

  • Number of Terminals:

    325

  • Operating Temperature-Max:

    85 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    BGA

  • Package Equivalence Code:

    BGA325,21X21,20

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY

  • Packing Method:

    TRAY

  • Programmable Logic Type:

    FIELD PROGRAMMABLE GATE ARRAY

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.01 mm

  • Supply Voltage-Max:

    1.26 V

  • Supply Voltage-Min:

    1.14 V

  • Supply Voltage-Nom:

    1.2 V

  • Surface Mount:

    YES

  • Technology:

    CMOS, 65 nm

  • Temperature Grade:

    OTHER

  • Terminal Finish:

    Tin/Lead (Sn63Pb37)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    BOTTOM

  • Width:

    11 mm

M2GL050-FCS325 Frequently Asked Questions (FAQs)

  • Microchip provides a reference design and layout guidelines in the M2GL050-FCS325 User's Guide (DS50002483A). Additionally, ensure proper thermal management by providing a heat sink and following the recommended thermal pad layout.
  • To minimize power consumption, use the device's power-saving features, such as clock gating, dynamic voltage and frequency scaling, and power-down modes. Also, optimize your design to reduce switching activity, use low-power peripherals, and consider using a low-power FPGA configuration.
  • The M2GL050-FCS325 is not designed for high-reliability or safety-critical applications. For such applications, consider using devices with specific safety and reliability features, such as those with ISO 26262 or IEC 61508 certifications. Additionally, ensure that your design meets the required safety and reliability standards.
  • Implement a secure boot mechanism using the device's built-in security features, such as the AES encryption engine and secure boot ROM. Use a secure firmware update mechanism, and ensure that your firmware is digitally signed and validated during boot.
  • Use Microchip's Libero SoC Design Suite for design, simulation, and debugging. Implement a testbench and use the device's built-in debug features, such as the JTAG interface and debug ports. Also, use oscilloscopes and logic analyzers to monitor and analyze the device's behavior.

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M2GL050-FCS325 Overview

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About Microchip

Microchip Technology Inc. is a leading manufacturer of microcontrollers and semiconductor devices for a wide range of applications in the aerospace, automotive, consumer electronics, industrial, and medical industries. Alongside a comprehensive product portfolio, Microchip Technology Inc. also provides easy-to-use development tools that enable engineers to create optimal designs quickly with minimal iterations to reduce risk while lowering total system costs to market. Headquartered in Chandler, Arizona, th

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Part Image M2GL050-FCSG325 Microsemi Corporation (now Microchip)

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