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M2GL050TS-1FCS325I - Microsemi Corporation

Description: IGLOO2 Field Programmable Gate Array (FPGA) IC 200 1869824 56340 325-TFBGA, FCBGA

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M2GL050TS-1FCS325I - Microsemi Corporation PCB footprint - BGA - BGA - FCS325
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M2GL050TS-1FCS325I - Microsemi Corporation  - 3D model - BGA - FCS325
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M2GL050TS-1FCS325I Details

  • Manufacturer Part Number:

    M2GL050TS-1FCS325I

  • Part Life Cycle Code:

    Transferred

  • Package Description:

    11 X 11 MM, 0.50 MM PITCH, FBGA-325

  • HTS Code:

    8542.31.00.60

  • Manufacturer:

    Microsemi Corporation (now Microchip)

  • JESD-30 Code:

    S-PBGA-B325

  • Number of Inputs:

    200

  • Number of Logic Cells:

    56340

  • Number of Outputs:

    200

  • Number of Terminals:

    325

  • Operating Temperature-Max:

    100 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    BGA

  • Package Equivalence Code:

    BGA325,21X21,20

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY

  • Peak Reflow Temperature (Cel):

    240

  • Programmable Logic Type:

    FIELD PROGRAMMABLE GATE ARRAY

  • Qualification Status:

    Not Qualified

  • Supply Voltage-Max:

    1.26 V

  • Supply Voltage-Min:

    1.14 V

  • Supply Voltage-Nom:

    1.2 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Form:

    BALL

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    20

M2GL050TS-1FCS325I Frequently Asked Questions (FAQs)

  • Microsemi provides a PCB design guide and layout recommendations in their documentation, including the 'M2GL050TS-1FCS325I FPGA PCB Design Guidelines' and 'M2GL050TS-1FCS325I FPGA Package Outline'. Additionally, engineers can use Microsemi's Libero SoC design software to generate a PCB layout and routing strategy.
  • Microsemi recommends using an external POR circuit, such as the MIC5233 or MIC5235, which can provide a reliable power-on reset signal to the FPGA. The datasheet provides guidelines for implementing a POR circuit, including the recommended voltage levels and timing requirements.
  • The M2GL050TS-1FCS325I FPGA has a thermal design power (TDP) of 2.5W. Engineers should consider using thermal management techniques such as heat sinks, thermal interfaces, and airflow management to keep the FPGA within its recommended operating temperature range of 0°C to 85°C.
  • Microsemi provides a Clocking and PLL User Guide, which explains how to configure the FPGA's clocking and PLLs using the Libero SoC design software. Engineers can also use the FPGA's built-in clocking and PLL primitives to implement custom clocking schemes.
  • The M2GL050TS-1FCS325I FPGA has built-in security features such as AES encryption, secure boot, and tamper detection. Microsemi provides documentation and software tools, such as the Libero SoC design software and the Microsemi Security Toolkit, to help engineers implement these security features in their designs.

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M2GL050TS-1FCS325I Overview

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Part Image M2GL050TS-1FCSG325I Microsemi Corporation (now Microchip)

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