Part Image

M2GL060-VFG400I - Microsemi Corporation

Description: FPGA - Field Programmable Gate Array M2GL060-VFG400I

Download M2GL060-VFG400I Model
Schematic
symbols
Schematic symbol is unavailable for download
PCB
footprints
PCB footprint is unavailable for download
3D
models
3D model is unavailable for download
PCB Footprints
M2GL060-VFG400I - Microsemi Corporation PCB footprint - BGA - BGA - M2GL060-VFG400I
click to zoom
3D Models
M2GL060-VFG400I - Microsemi Corporation  - 3D model - BGA - M2GL060-VFG400I
click to zoom

M2GL060-VFG400I Details

  • Manufacturer Part Number:

    M2GL060-VFG400I

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Transferred

  • Package Description:

    17 X 17 MM, 0.80 MM PITCH, ROHS COMPLIANT, VFBGA-400

  • HTS Code:

    8542.31.00.60

  • Manufacturer:

    Microsemi Corporation (now Microchip)

  • JESD-30 Code:

    S-PBGA-B400

  • Length:

    17 mm

  • Moisture Sensitivity Level:

    3

  • Number of Terminals:

    400

  • Operating Temperature-Max:

    100 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    LFBGA

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY, LOW PROFILE, FINE PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Programmable Logic Type:

    FIELD PROGRAMMABLE GATE ARRAY

  • Seated Height-Max:

    1.51 mm

  • Supply Voltage-Max:

    1.26 V

  • Supply Voltage-Min:

    1.14 V

  • Supply Voltage-Nom:

    1.2 V

  • Surface Mount:

    YES

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.8 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    17 mm

M2GL060-VFG400I Frequently Asked Questions (FAQs)

  • Microsemi provides a PCB design guide for the M2GL060-VFG400I, which includes guidelines for signal integrity, power distribution, and thermal management. It's recommended to follow these guidelines to ensure optimal performance and reliability.
  • A reliable POR circuit can be implemented using a voltage supervisor IC, such as the Microsemi MIC2777, which provides a reset signal to the FPGA during power-up and power-down sequences. The POR circuit should be designed to ensure a clean and monotonic power-up sequence.
  • The M2GL060-VFG400I has a maximum junction temperature of 100°C. To prevent overheating, ensure good airflow around the device, use a heat sink if necessary, and implement thermal management techniques such as thermal throttling or dynamic voltage and frequency scaling.
  • To optimize power consumption, use the FPGA's built-in power management features, such as dynamic voltage and frequency scaling, clock gating, and power gating. Additionally, optimize the design to minimize switching activity, use low-power IP cores, and consider using a low-power FPGA fabric.
  • Microsemi provides a JTAG and boundary scan testing guide for the M2GL060-VFG400I, which includes procedures for testing and debugging the FPGA. It's recommended to follow these guidelines to ensure reliable testing and debugging.

Trust Checks

This model has been provided by community users.
Community Provided
This model has been verified by system checks.
System Verified
This model has been reviewed by community users.
Community Approved
Sponsored

M2GL060-VFG400I Overview

Use the download button to access the M2GL060-VFG400I schematic symbol, PCB footprint, and 3D model.
To find more CAD model downloads similar to this part, try a partial part number search, like M2GL0, or try a keyword search, such as Field Programmable Gate Arrays

Parts related to M2GL060-VFG400I

Showing 0 results

M2GL060-VFG400I Alternates

Showing results

Image Part Number Model
Part Image M2GL060-VFG400I Microchip Technology Inc

IGLOO2 Low Density FPGA, 56.5KLEs