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M2GL060T-FGG484 - Microsemi Corporation

Description: IGLOO2 FPGA

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PCB Footprints
M2GL060T-FGG484 - Microsemi Corporation PCB footprint - BGA - BGA - FG484 MS-034 VAR AAJ-1
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3D Models
M2GL060T-FGG484 - Microsemi Corporation  - 3D model - BGA - FG484 MS-034 VAR AAJ-1
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M2GL060T-FGG484 Details

  • Manufacturer Part Number:

    M2GL060T-FGG484

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Transferred

  • Package Description:

    23 X 23 MM, 1 MM PITCH, ROHS COMPLIANT, FBGA-484

  • HTS Code:

    8542.31.00.60

  • Manufacturer:

    Microsemi Corporation (now Microchip)

  • JESD-30 Code:

    S-PBGA-B484

  • Length:

    23 mm

  • Moisture Sensitivity Level:

    3

  • Number of Terminals:

    484

  • Operating Temperature-Max:

    85 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    BGA

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY

  • Peak Reflow Temperature (Cel):

    250

  • Programmable Logic Type:

    FIELD PROGRAMMABLE GATE ARRAY

  • Seated Height-Max:

    2.44 mm

  • Supply Voltage-Max:

    1.26 V

  • Supply Voltage-Min:

    1.14 V

  • Supply Voltage-Nom:

    1.2 V

  • Surface Mount:

    YES

  • Temperature Grade:

    OTHER

  • Terminal Form:

    BALL

  • Terminal Pitch:

    1 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    23 mm

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M2GL060T-FGG484 Overview

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