M2GL060T-FGG676 - Microsemi Corporation

M2GL060T-FGG676 Details

• Manufacturer Part Number:

  M2GL060T-FGG676

• Rohs Code:

  Yes

• Part Life Cycle Code:

  Transferred

• Package Description:

  BGA, BGA676,26X26,40

• Reach Compliance Code:

  Compliant

• HTS Code:

  8542.31.00.60

• Manufacturer:

  Microsemi Corporation (now Microchip)

• JESD-30 Code:

  S-PBGA-B676

• Length:

  27 mm

• Moisture Sensitivity Level:

  3

• Number of Terminals:

  676

• Operating Temperature-Max:

  85 °C

• Package Body Material:

  PLASTIC/EPOXY

• Package Code:

  BGA

• Package Equivalence Code:

  BGA676,26X26,40

• Package Shape:

  SQUARE

• Package Style:

  GRID ARRAY

• Peak Reflow Temperature (Cel):

  250

• Programmable Logic Type:

  FIELD PROGRAMMABLE GATE ARRAY

• Seated Height-Max:

  2.44 mm

• Supply Voltage-Max:

  1.26 V

• Supply Voltage-Min:

  1.14 V

• Supply Voltage-Nom:

  1.2 V

• Surface Mount:

  YES

• Temperature Grade:

  OTHER

• Terminal Form:

  BALL

• Terminal Pitch:

  1 mm

• Terminal Position:

  BOTTOM

• Time@Peak Reflow Temperature-Max (s):

  30

• Width:

  27 mm