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M2GL090TS-1FGG484M - Microchip

Description: FPGA - Field Programmable Gate Array M2GL090TS-1FGG484M

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M2GL090TS-1FGG484M - Microchip PCB footprint - BGA - BGA - FG484 MS-034 VAR AAJ-1
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M2GL090TS-1FGG484M - Microchip  - 3D model - BGA - FG484 MS-034 VAR AAJ-1
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M2GL090TS-1FGG484M Details

  • Manufacturer Part Number:

    M2GL090TS-1FGG484M

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    FPBGA-484

  • Pin Count:

    484

  • Manufacturer Package Code:

    PBGA-484

  • Country Of Origin:

    South Korea

  • ECCN Code:

    3A001.a.2.c

  • HTS Code:

    8542.31.00.60

  • Factory Lead Time:

    16 Weeks

  • Manufacturer:

    Microchip Technology Inc

  • YTEOL:

    23

  • JESD-30 Code:

    S-PBGA-B484

  • JESD-609 Code:

    e1

  • Length:

    23 mm

  • Moisture Sensitivity Level:

    3

  • Number of Inputs:

    267

  • Number of Outputs:

    267

  • Number of Terminals:

    484

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    BGA

  • Package Equivalence Code:

    BGA484,22X22,40

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY

  • Peak Reflow Temperature (Cel):

    250

  • Programmable Logic Type:

    FIELD PROGRAMMABLE GATE ARRAY

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    2.44 mm

  • Supply Voltage-Max:

    1.26 V

  • Supply Voltage-Min:

    1.14 V

  • Supply Voltage-Nom:

    1.2 V

  • Surface Mount:

    YES

  • Technology:

    65 nm

  • Temperature Grade:

    MILITARY

  • Terminal Finish:

    Tin/Silver/Copper (Sn/Ag/Cu)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    1 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    23 mm

M2GL090TS-1FGG484M Frequently Asked Questions (FAQs)

  • Microchip provides a PCB design guide and layout recommendations in the M2GL090TS-1FGG484M FPGA PCB Design and Layout Guidelines document. It's essential to follow these guidelines to ensure signal integrity, reduce noise, and meet timing requirements.
  • The M2GL090TS-1FGG484M FPGA has a built-in POR circuit, but it's recommended to use an external POR circuit to ensure a reliable reset. A simple POR circuit can be implemented using a voltage supervisor IC, such as the Microchip MCP112 or MCP113, which can detect power-on and power-down conditions and generate a reset signal.
  • The M2GL090TS-1FGG484M FPGA has a thermal design power (TDP) of 2.5W. To ensure reliable operation, it's essential to provide adequate heat dissipation. This can be achieved by using a heat sink, thermal interface material, and ensuring good airflow around the device. The FPGA's thermal management guidelines are provided in the M2GL090TS-1FGG484M FPGA Thermal Management document.
  • The M2GL090TS-1FGG484M FPGA has a flexible clocking system that can be configured using the Microchip Libero SoC design software. The recommended clocking architectures are described in the M2GL090TS-1FGG484M FPGA Clocking and PLL User's Guide. It's essential to follow these guidelines to ensure clock signal integrity and meet timing requirements.
  • The M2GL090TS-1FGG484M FPGA has a range of security features, including a secure boot mechanism, encrypted firmware storage, and a hardware-based root of trust. To implement secure boot and secure firmware storage, refer to the M2GL090TS-1FGG484M FPGA Security User's Guide and the Microchip TrustFPGA security framework.

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M2GL090TS-1FGG484M Overview

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About Microchip

Microchip Technology Inc. is a leading manufacturer of microcontrollers and semiconductor devices for a wide range of applications in the aerospace, automotive, consumer electronics, industrial, and medical industries. Alongside a comprehensive product portfolio, Microchip Technology Inc. also provides easy-to-use development tools that enable engineers to create optimal designs quickly with minimal iterations to reduce risk while lowering total system costs to market. Headquartered in Chandler, Arizona, th

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