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M2GL150-1FCG1152I - Microsemi Corporation

Description: IGLOO2 Field Programmable Gate Array (FPGA) IC 574 5120000 146124 1152-BBGA, FCBGA

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M2GL150-1FCG1152I - Microsemi Corporation PCB footprint - BGA - BGA - FC1152
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M2GL150-1FCG1152I - Microsemi Corporation  - 3D model - BGA - FC1152
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M2GL150-1FCG1152I Details

  • Manufacturer Part Number:

    M2GL150-1FCG1152I

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Transferred

  • Package Description:

    35 X 35 MM, 1 MM PITCH, ROHS COMPLIANT, FBGA-1152

  • Similar Group:

    PG0214901466148910341179

  • HTS Code:

    8542.31.00.60

  • Manufacturer:

    Microsemi Corporation (now Microchip)

  • JESD-30 Code:

    S-PBGA-B1152

  • Length:

    35 mm

  • Moisture Sensitivity Level:

    4

  • Number of Inputs:

    574

  • Number of Logic Cells:

    146124

  • Number of Outputs:

    574

  • Number of Terminals:

    1152

  • Operating Temperature-Max:

    100 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    BGA

  • Package Equivalence Code:

    BGA1152,34X34,40

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY

  • Programmable Logic Type:

    FIELD PROGRAMMABLE GATE ARRAY

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    2.9 mm

  • Supply Voltage-Max:

    1.26 V

  • Supply Voltage-Min:

    1.14 V

  • Supply Voltage-Nom:

    1.2 V

  • Surface Mount:

    YES

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Form:

    BALL

  • Terminal Pitch:

    1 mm

  • Terminal Position:

    BOTTOM

  • Width:

    35 mm

M2GL150-1FCG1152I Frequently Asked Questions (FAQs)

  • Microsemi provides a PCB design guide for the M2GL150-1FCG1152I, which includes recommendations for signal integrity, power distribution, and thermal management. It's essential to follow these guidelines to ensure reliable operation and minimize signal degradation.
  • A reliable POR circuit can be implemented using a voltage supervisor IC, such as the Microsemi LX7160, which monitors the power supply voltage and generates a reset signal when the voltage is below a certain threshold. The POR circuit should be designed to ensure that the FPGA is properly reset during power-up and power-down sequences.
  • The M2GL150-1FCG1152I has a maximum junction temperature of 100°C. To ensure reliable operation, it's essential to implement proper thermal management, including heat sinks, thermal interfaces, and airflow management. Microsemi provides thermal design guidelines and thermal models to help with thermal management.
  • Optimizing the clock tree involves using the FPGA's built-in clock management resources, such as the clock management unit (CMU) and the phase-locked loop (PLL). It's essential to follow Microsemi's guidelines for clock tree design and to use the FPGA's built-in clock analysis tools to minimize skew and jitter.
  • The M2GL150-1FCG1152I has built-in security features, including a secure boot mechanism and a cryptographic engine. To implement secure boot and secure firmware updates, follow Microsemi's guidelines for secure boot and firmware update protocols, and use the FPGA's built-in security features, such as the advanced encryption standard (AES) and the secure hash algorithm (SHA).

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M2GL150-1FCG1152I Overview

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Part Image M2GL150-1FC1152I Microsemi Corporation (now Microchip)

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