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M2S025-FGG484I - Microchip

Description: ARM® Cortex®-M3 System On Chip (SOC) IC SmartFusion®2 FPGA - 25K Logic Modules 166MHz 484-FPBGA (23x23)

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M2S025-FGG484I - Microchip PCB footprint - BGA - BGA - FG-484
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M2S025-FGG484I - Microchip  - 3D model - BGA - FG-484
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M2S025-FGG484I Details

  • Manufacturer Part Number:

    M2S025-FGG484I

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    FBGA-484

  • Pin Count:

    484

  • Manufacturer Package Code:

    PBGA-484

  • Country Of Origin:

    South Korea

  • HTS Code:

    8542.31.00.60

  • Factory Lead Time:

    12 Weeks

  • Manufacturer:

    Microchip Technology Inc

  • YTEOL:

    23

  • JESD-30 Code:

    S-PBGA-B484

  • JESD-609 Code:

    e1

  • Length:

    23 mm

  • Moisture Sensitivity Level:

    3

  • Number of Inputs:

    267

  • Number of Logic Cells:

    27696

  • Number of Outputs:

    267

  • Number of Terminals:

    484

  • Operating Temperature-Max:

    100 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    BGA

  • Package Equivalence Code:

    BGA484,22X22,40

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY

  • Peak Reflow Temperature (Cel):

    250

  • Programmable Logic Type:

    FPGA SOC

  • Seated Height-Max:

    2.44 mm

  • Supply Voltage-Max:

    1.26 V

  • Supply Voltage-Min:

    1.14 V

  • Supply Voltage-Nom:

    1.2 V

  • Surface Mount:

    YES

  • Technology:

    65 nm

  • Terminal Finish:

    Tin/Silver/Copper (Sn/Ag/Cu)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    1 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    40

  • Width:

    23 mm

M2S025-FGG484I Frequently Asked Questions (FAQs)

  • Microchip provides a PCB design guide for the M2S025-FGG484I, which includes recommendations for PCB layout, routing, and signal integrity. It's essential to follow these guidelines to ensure signal integrity and minimize electromagnetic interference (EMI).
  • A reliable POR circuit can be implemented using a voltage supervisor IC, such as the Microchip MCP112-315JE/MS, which provides a reset signal to the FPGA when the power supply voltage is within the specified range. The POR circuit should be designed to ensure that the FPGA is properly reset during power-up and power-down sequences.
  • The M2S025-FGG484I has a maximum junction temperature (TJ) of 100°C. To ensure reliable operation, it's essential to implement proper thermal management, including heat sinks, thermal interfaces, and airflow management. The thermal design should be optimized to keep the junction temperature below the maximum specified value.
  • To optimize the clock tree, it's essential to follow Microchip's guidelines for clock tree design, including the use of dedicated clock networks, clock domain crossing, and clock gating. Additionally, the clock tree should be optimized for low skew and jitter using tools such as the Microchip Clock Wizard or third-party tools like Synopsys' Clock Domain Crossing (CDC) analysis.
  • To implement a secure boot process, it's essential to use a secure boot mechanism, such as Microchip's Secure Boot, which provides a secure way to boot the FPGA. The secure boot process should include features like authentication, encryption, and secure key storage to prevent unauthorized access and ensure the integrity of the FPGA's configuration.

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M2S025-FGG484I Overview

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About Microchip

Microchip Technology Inc. is a leading manufacturer of microcontrollers and semiconductor devices for a wide range of applications in the aerospace, automotive, consumer electronics, industrial, and medical industries. Alongside a comprehensive product portfolio, Microchip Technology Inc. also provides easy-to-use development tools that enable engineers to create optimal designs quickly with minimal iterations to reduce risk while lowering total system costs to market. Headquartered in Chandler, Arizona, th

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