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M2S090T-1FG484M - Microchip

Description: ARM® Cortex®-M3 System On Chip (SOC) IC SmartFusion®2 FPGA - 90K Logic Modules 166MHz 484-FPBGA (23x23)

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M2S090T-1FG484M - Microchip PCB footprint - BGA - BGA - FG484—Fully Populated MS-034 VAR AAJ-1, Larger Mold Cap Size
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M2S090T-1FG484M - Microchip  - 3D model - BGA - FG484—Fully Populated MS-034 VAR AAJ-1, Larger Mold Cap Size
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M2S090T-1FG484M Details

  • Manufacturer Part Number:

    M2S090T-1FG484M

  • Rohs Code:

    No

  • Part Life Cycle Code:

    Active

  • Package Description:

    FPBGA-484

  • Pin Count:

    484

  • Manufacturer Package Code:

    PBGA-484

  • Country Of Origin:

    South Korea

  • ECCN Code:

    3A001.a.2.c

  • HTS Code:

    8542.31.00.60

  • Factory Lead Time:

    16 Weeks

  • Manufacturer:

    Microchip Technology Inc

  • YTEOL:

    23

  • JESD-30 Code:

    S-PBGA-B484

  • JESD-609 Code:

    e0

  • Length:

    23 mm

  • Number of Inputs:

    267

  • Number of Outputs:

    267

  • Number of Terminals:

    484

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    BGA

  • Package Equivalence Code:

    BGA484,22X22,40

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY

  • Programmable Logic Type:

    FPGA SOC

  • Seated Height-Max:

    2.44 mm

  • Supply Voltage-Max:

    1.26 V

  • Supply Voltage-Min:

    1.14 V

  • Supply Voltage-Nom:

    1.2 V

  • Surface Mount:

    YES

  • Technology:

    65 nm

  • Terminal Finish:

    Tin/Lead (Sn/Pb)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    1 mm

  • Terminal Position:

    BOTTOM

  • Width:

    23 mm

M2S090T-1FG484M Frequently Asked Questions (FAQs)

  • Microchip provides a PCB design guide for the M2S090T-1FG484M, which includes recommendations for PCB layout, routing, and signal integrity. It's essential to follow these guidelines to ensure signal integrity and minimize electromagnetic interference (EMI).
  • A reliable POR circuit can be implemented using an external voltage supervisor IC, such as the Microchip MCP112-300, which can detect the power supply voltage and generate a reset signal to the FPGA. The datasheet provides guidelines for POR circuit design.
  • The M2S090T-1FG484M has a thermal design power (TDP) of 1.5W. To ensure reliable operation, it's essential to provide adequate heat dissipation through a heat sink, thermal interface material, and proper PCB design. Microchip provides thermal management guidelines in the datasheet.
  • The M2S090T-1FG484M has a flexible clocking system that can be configured using the Microchip Libero SoC design software. The software provides a clocking wizard that helps configure the clock domains, clock frequencies, and clock routing.
  • The M2S090T-1FG484M has a range of security features, including AES encryption, secure boot, and a hardware-based root of trust. These features can be used to implement secure boot mechanisms, encrypt data, and protect against unauthorized access.

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M2S090T-1FG484M Overview

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About Microchip

Microchip Technology Inc. is a leading manufacturer of microcontrollers and semiconductor devices for a wide range of applications in the aerospace, automotive, consumer electronics, industrial, and medical industries. Alongside a comprehensive product portfolio, Microchip Technology Inc. also provides easy-to-use development tools that enable engineers to create optimal designs quickly with minimal iterations to reduce risk while lowering total system costs to market. Headquartered in Chandler, Arizona, th

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