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M2S150TS-1FCV484 - Microsemi Corporation

Description: SmartFusion2 System-on-Chip FPGA

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PCB Footprints
M2S150TS-1FCV484 - Microsemi Corporation PCB footprint - BGA - BGA - M2GL150-FCV484I
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3D Models
M2S150TS-1FCV484 - Microsemi Corporation  - 3D model - BGA - M2GL150-FCV484I
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M2S150TS-1FCV484 Details

  • Manufacturer Part Number:

    M2S150TS-1FCV484

  • Pbfree Code:

    No

  • Part Life Cycle Code:

    Transferred

  • Package Description:

    VFBGA-484

  • HTS Code:

    8542.31.00.60

  • Manufacturer:

    Microsemi Corporation (now Microchip)

  • Additional Feature:

    LG-MIN, WD-MIN

  • JESD-30 Code:

    S-PBGA-B484

  • JESD-609 Code:

    e0

  • Length:

    19 mm

  • Number of Terminals:

    484

  • Operating Temperature-Max:

    85 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    FBGA

  • Package Equivalence Code:

    BGA484,22X22,32

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY, FINE PITCH

  • Peak Reflow Temperature (Cel):

    240

  • Programmable Logic Type:

    FIELD PROGRAMMABLE GATE ARRAY

  • Seated Height-Max:

    3.15 mm

  • Supply Voltage-Max:

    1.26 V

  • Supply Voltage-Min:

    1.14 V

  • Supply Voltage-Nom:

    1.2 V

  • Surface Mount:

    YES

  • Terminal Finish:

    Tin/Lead (Sn/Pb)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.8 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    19 mm

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M2S150TS-1FCV484 Overview

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M2S150TS-1FCV484 Alternates

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Part Image M2S150TS-1FCVG484I Microchip Technology Inc

PBGA484

Part Image M2S150TS-1FCVG484 Microsemi Corporation (now Microchip)

Field Programmable Gate Array, PBGA484