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M95512-DRDW3TP/K - STMicroelectronics

Description: Automotive 512-Kbit serial SPI bus EEPROMs with high-speed clock

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M95512-DRDW3TP/K - STMicroelectronics PCB footprint - Small Outline Packages - Small Outline Packages - TSSOP8
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M95512-DRDW3TP/K - STMicroelectronics  - 3D model - Small Outline Packages - TSSOP8
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M95512-DRDW3TP/K Details

  • Manufacturer Part Number:

    M95512-DRDW3TP/K

  • Brand Name:

    STMicroelectronics

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOIC

  • Package Description:

    0.169 INCH, HALOGEN FREE AND ROHS COMPLIANT, TSSOP-8

  • Pin Count:

    8

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.32.00.51

  • Factory Lead Time:

    14 Weeks

  • Manufacturer:

    STMicroelectronics

  • YTEOL:

    15

  • Clock Frequency-Max (fCLK):

    5 MHz

  • Data Retention Time-Min:

    40

  • Endurance:

    4000000 Write/Erase Cycles

  • JESD-30 Code:

    R-PDSO-G8

  • JESD-609 Code:

    e4

  • Length:

    4.4 mm

  • Memory Density:

    524288 bit

  • Memory IC Type:

    EEPROM

  • Memory Width:

    8

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Number of Words:

    65536 words

  • Number of Words Code:

    64000

  • Operating Mode:

    SYNCHRONOUS

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Organization:

    64KX8

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Equivalence Code:

    TSSOP8,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Parallel/Serial:

    SERIAL

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.2 mm

  • Serial Bus Type:

    SPI

  • Standby Current-Max:

    0.000001 A

  • Supply Current-Max:

    0.005 mA

  • Supply Voltage-Max (Vsup):

    5.5 V

  • Supply Voltage-Min (Vsup):

    1.8 V

  • Supply Voltage-Nom (Vsup):

    5 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    3 mm

  • Write Cycle Time-Max (tWC):

    4 ms

  • Write Protection:

    HARDWARE/SOFTWARE

M95512-DRDW3TP/K Frequently Asked Questions (FAQs)

  • STMicroelectronics recommends a thermal pad on the bottom of the package, connected to a large copper area on the PCB to dissipate heat efficiently. A minimum of 2oz copper thickness is recommended.
  • To ensure reliable data retention, it is recommended to use a capacitor (e.g., 10uF) connected between VCC and VSS, and a diode (e.g., 1N4148) between VCC and the power supply to prevent back-powering.
  • The maximum clock frequency for the SPI interface is 20 MHz, but it can be operated at higher frequencies with proper PCB design and signal integrity considerations.
  • The M95512-DRDW3TP/K is not specifically designed for radiation-intensive environments. However, STMicroelectronics offers radiation-hardened versions of similar devices, such as the M95512-RDW3TP/K, which is designed for aerospace and defense applications.
  • The recommended storage temperature range for the M95512-DRDW3TP/K is -40°C to +125°C, but it's essential to follow the specific storage guidelines outlined in the datasheet to ensure device reliability.

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M95512-DRDW3TP/K Overview

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About STMicroelectronics

STMicroelectronics (ST) is a global semiconductor company that designs, manufactures, and markets a broad range of integrated circuits (ICs), discrete devices, and other electronic components. STMicroelectronics offers a diverse portfolio of semiconductor products covering a wide range of applications and industries. Their product categories include microcontrollers, analog and mixed-signal ICs, MEMS (Micro-Electro-Mechanical Systems) sensors, power management ICs, RF (Radio Frequency) transceivers, aut

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