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MA4P789ST-287T - MACOM

Description: PIN Diodes Ls=1.4nH Cp=.12pF Series TEE SOT-23

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PCB Footprints
MA4P789ST-287T - MACOM PCB footprint - SOT23 (3-Pin) - SOT23 (3-Pin) - sot23
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3D Models
MA4P789ST-287T - MACOM  - 3D model - SOT23 (3-Pin) - sot23
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MA4P789ST-287T Details

  • Manufacturer Part Number:

    MA4P789ST-287T

  • Pbfree Code:

    No

  • Part Life Cycle Code:

    Obsolete

  • Package Description:

    PLASTIC, CASE 287, 3 PIN

  • Pin Count:

    3

  • Manufacturer Package Code:

    CASE 287

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.80

  • Manufacturer:

    MACOM

  • YTEOL:

    0

  • Additional Feature:

    LOW DISTORTION

  • Application:

    SWITCHING

  • Breakdown Voltage-Min:

    75 V

  • Configuration:

    SERIES CONNECTED, CENTER TAP, 2 ELEMENTS

  • Diode Capacitance-Max:

    0.35 pF

  • Diode Element Material:

    SILICON

  • Diode Forward Resistance-Max:

    1.5 Ω

  • Diode Res Test Current:

    10 mA

  • Diode Type:

    PIN DIODE

  • Frequency Band:

    S BAND

  • JESD-30 Code:

    R-PDSO-G3

  • Minority Carrier Lifetime-Nom:

    0.2 µs

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    2

  • Number of Terminals:

    3

  • Operating Temperature-Max:

    175 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Power Dissipation-Max:

    0.25 W

  • Qualification Status:

    Not Qualified

  • Surface Mount:

    YES

  • Technology:

    POSITIVE-INTRINSIC-NEGATIVE

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

MA4P789ST-287T Frequently Asked Questions (FAQs)

  • A thermal via array under the device, with a solid copper pour on the backside of the PCB, and a thermal relief pattern around the device can help to optimize thermal performance.
  • Use a low-ESR capacitor (e.g., 100nF) in parallel with a high-voltage capacitor (e.g., 1uF) to filter out voltage spikes and ensure stable operation during high-power pulses.
  • A gate drive voltage of 0V to -2.5V and a current of 100mA to 200mA is recommended for optimal performance and to minimize power consumption.
  • Implement a thermal monitoring and shutdown circuit to prevent thermal runaway. Monitor the device temperature and shut down the device if it exceeds the maximum operating temperature (150°C).
  • Use a wedge bonding technique with a 1-mil aluminum wire and a bonding force of 30-40 grams to ensure reliable connections.

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MA4P789ST-287T Overview

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