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MACP-010250-C808A0 - MACOM

Description: Signal Conditioning 5-1200MHz 8dB Iso 27dB

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MACP-010250-C808A0 - MACOM PCB footprint - Other - Other - MACP-010250-C808A0
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MACP-010250-C808A0 - MACOM  - 3D model - Other - MACP-010250-C808A0
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MACP-010250-C808A0 Details

  • Manufacturer Part Number:

    MACP-010250-C808A0

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    ROHS COMPLIANT, SURFACE MOUNT PACKAGE-5

  • Manufacturer:

    MACOM

  • YTEOL:

    6.94

  • Characteristic Impedance:

    75 Ω

  • Construction:

    COMPONENT

  • Input Power-Max (CW):

    28 dBm

  • Insertion Loss-Max:

    2.3 dB

  • Operating Frequency-Max:

    1200 MHz

  • Operating Frequency-Min:

    5 MHz

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • RF/Microwave Device Type:

    DIRECTIONAL COUPLER

  • VSWR-Max:

    1.03

MACP-010250-C808A0 Frequently Asked Questions (FAQs)

  • MACOM recommends a 4-layer PCB with a solid ground plane, and a thermal pad connected to a heat sink or a thermal via to ensure efficient heat dissipation. A minimum of 10mm x 10mm of copper area is recommended for the thermal pad.
  • The MACP-010250-C808A0 requires a bias voltage of 5V ± 10% and a bias current of 100mA ± 10%. Ensure the bias circuitry is designed to provide a stable voltage and current, and that the device is properly terminated to prevent oscillations.
  • The MACP-010250-C808A0 is rated for operation from -40°C to +85°C. However, it's recommended to derate the device's performance and power handling at temperatures above +70°C to ensure reliability and prevent thermal runaway.
  • Common issues can be troubleshooted by checking the PCB layout for proper grounding and decoupling, ensuring the bias circuitry is stable and well-regulated, and verifying that the device is properly terminated. MACOM also recommends using a spectrum analyzer to identify any unwanted frequency components.
  • Yes, the MACP-010250-C808A0 is an ESD-sensitive device. Handle the device with ESD-protective equipment, store it in an ESD-protective package, and ensure the PCB is designed with ESD protection in mind to prevent damage during assembly and testing.

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