MAP9002ESRH footprint, schematic symbol and 3D model by MagnaChip

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PCB Footprints

MAP9002ESRH Details

A 4-layer PCB with a dedicated thermal plane and vias under the package is recommended for optimal thermal performance. Ensure a solid ground plane on the bottom layer and a thermal relief pattern on the top layer.
Implement a thermal management system, such as a heat sink or fan, to keep the junction temperature below 150°C. Also, ensure proper PCB design, component selection, and thermal interface material usage.
Use X5R or X7R ceramic capacitors with a voltage rating of 10V or higher for input and output capacitors. A 10uF capacitor for input and a 22uF capacitor for output are recommended.
Use a shielded enclosure, keep the PCB layout compact, and use a common-mode choke or ferrite bead on the input lines. Ensure proper grounding and decoupling of the device.
Apply the input voltage (VIN) first, followed by the enable signal (EN). Ensure the input voltage is stable before applying the enable signal.

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Use the download button to access the MAP9002ESRH schematic symbol and PCB footprint.

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