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MASTERGAN1LTR - STMicroelectronics

Description: 600 V half-bridge enhancement mode GaN HEMT with high voltage driver

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PCB Footprints
MASTERGAN1LTR - STMicroelectronics PCB footprint - Other - Other - QFN 9 x 9 x 1 mm, 31 leads, pitch 0.6 mm
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3D Models
MASTERGAN1LTR - STMicroelectronics  - 3D model - Other - QFN 9 x 9 x 1 mm, 31 leads, pitch 0.6 mm
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MASTERGAN1LTR Details

  • Manufacturer Part Number:

    MASTERGAN1LTR

  • Part Life Cycle Code:

    Active

  • Package Description:

    QFN-31

  • Country Of Origin:

    Thailand

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    16 Weeks

  • Manufacturer:

    STMicroelectronics

  • YTEOL:

    1

  • High Side Driver:

    YES

  • Input Characteristics:

    SCHMITT TRIGGER

  • Interface IC Type:

    HALF BRIDGE BASED GAN FET DRIVER

  • JESD-30 Code:

    S-XQCC-N31

  • Length:

    9 mm

  • Number of Functions:

    1

  • Number of Terminals:

    31

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Characteristics:

    PUSH-PULL

  • Output Peak Current Limit-Nom:

    17 A

  • Package Body Material:

    UNSPECIFIED

  • Package Code:

    HVQCCN

  • Package Equivalence Code:

    LCC31,.35SQ,25

  • Package Shape:

    SQUARE

  • Package Style:

    CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

  • Seated Height-Max:

    1 mm

  • Supply Voltage-Max:

    9.5 V

  • Supply Voltage-Min:

    4.75 V

  • Supply Voltage-Nom:

    6 V

  • Supply Voltage1-Max:

    8.5 V

  • Supply Voltage1-Min:

    3 V

  • Supply Voltage1-Nom:

    6 V

  • Surface Mount:

    YES

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.6 mm

  • Terminal Position:

    QUAD

  • Turn-off Time:

    0.045 µs

  • Turn-on Time:

    0.045 µs

  • Width:

    9 mm

MASTERGAN1LTR Frequently Asked Questions (FAQs)

  • STMicroelectronics provides a recommended PCB layout in the application note AN5323, which includes guidelines for component placement, routing, and thermal management to minimize electromagnetic interference (EMI) and ensure reliable operation.
  • The input capacitor selection depends on the input voltage, current, and frequency. A general guideline is to choose a capacitor with a voltage rating of at least 1.5 times the maximum input voltage, and a capacitance value between 1uF to 10uF. Additionally, consider the capacitor's ESR (Equivalent Series Resistance) and ESL (Equivalent Series Inductance) to ensure it can handle the high-frequency switching of the MASTERGAN1LTR.
  • The MASTERGAN1LTR has an operating temperature range of -40°C to 150°C, but the maximum junction temperature (TJ) should not exceed 150°C. It's essential to ensure proper thermal management, such as using a heat sink or thermal interface material, to prevent overheating and ensure reliable operation.
  • Yes, the MASTERGAN1LTR is AEC-Q100 qualified, which makes it suitable for automotive and high-reliability applications. However, it's essential to follow the recommended design guidelines, testing, and validation procedures to ensure the device meets the specific requirements of the application.
  • To troubleshoot issues with MASTERGAN1LTR, start by verifying the PCB layout, component selection, and soldering quality. Check for any signs of overheating, and ensure the input voltage and current are within the recommended specifications. Use oscilloscopes or other diagnostic tools to analyze the output voltage, current, and frequency. Consult the datasheet, application notes, and STMicroelectronics' support resources for guidance on troubleshooting and debugging.

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MASTERGAN1LTR Overview

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About STMicroelectronics

STMicroelectronics (ST) is a global semiconductor company that designs, manufactures, and markets a broad range of integrated circuits (ICs), discrete devices, and other electronic components. STMicroelectronics offers a diverse portfolio of semiconductor products covering a wide range of applications and industries. Their product categories include microcontrollers, analog and mixed-signal ICs, MEMS (Micro-Electro-Mechanical Systems) sensors, power management ICs, RF (Radio Frequency) transceivers, aut

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