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MASTERGAN1TR - STMicroelectronics

Description: High power density 600V half-bridge driver with two enhancement mode GaN HEMTs

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MASTERGAN1TR - STMicroelectronics - PCB symbol
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MASTERGAN1TR - STMicroelectronics PCB footprint - Other - Other - MASTERGAN1TR-2
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3D Models
MASTERGAN1TR - STMicroelectronics - 3D model - Other - MASTERGAN1TR-2
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MASTERGAN1TR Details

  • Manufacturer Part Number:

    MASTERGAN1TR

  • Brand Name:

    STMicroelectronics

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    HVQCCN, LCC31,.35SQ,25

  • Reach Compliance Code:

    Compliant

  • Country Of Origin:

    Thailand

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Date Of Intro:

    2020-08-11

  • Manufacturer:

    STMicroelectronics

  • YTEOL:

    1

  • High Side Driver:

    YES

  • Input Characteristics:

    SCHMITT TRIGGER

  • Interface IC Type:

    HALF BRIDGE BASED GAN FET DRIVER

  • JESD-30 Code:

    S-XQCC-N31

  • Length:

    9 mm

  • Number of Functions:

    1

  • Number of Terminals:

    31

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Characteristics:

    PUSH-PULL

  • Output Peak Current Limit-Nom:

    17 A

  • Package Body Material:

    UNSPECIFIED

  • Package Code:

    HVQCCN

  • Package Equivalence Code:

    LCC31,.35SQ,25

  • Package Shape:

    SQUARE

  • Package Style:

    CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

  • Seated Height-Max:

    1 mm

  • Supply Voltage-Max:

    9.5 V

  • Supply Voltage-Min:

    4.75 V

  • Supply Voltage-Nom:

    6 V

  • Supply Voltage1-Max:

    8.5 V

  • Supply Voltage1-Min:

    3 V

  • Supply Voltage1-Nom:

    6 V

  • Surface Mount:

    YES

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.6 mm

  • Terminal Position:

    QUAD

  • Turn-off Time:

    0.07 µs

  • Turn-on Time:

    0.07 µs

  • Width:

    9 mm

MASTERGAN1TR Frequently Asked Questions (FAQs)

  • STMicroelectronics recommends a 4-layer PCB with a solid ground plane, and to keep the high-frequency traces as short as possible. A good layout practice is to keep the input and output stages separate, and to use a common mode choke to filter the input voltage.
  • To ensure stability, make sure to follow the recommended component values and PCB layout guidelines. Also, ensure that the input voltage is within the recommended range, and that the output capacitor is of high quality and has a low ESR.
  • The MASTERGAN1TR can operate in ambient temperatures up to 105°C, but the junction temperature should not exceed 150°C. It's recommended to use a heat sink or a thermal pad to ensure proper heat dissipation.
  • Yes, the MASTERGAN1TR is suitable for high-reliability applications. It's built with a robust design and has undergone rigorous testing to ensure its reliability. However, it's recommended to follow the recommended operating conditions and to perform thorough testing and validation in your specific application.
  • To troubleshoot issues with the MASTERGAN1TR, start by checking the input voltage and current, and ensure that the output voltage is within the recommended range. Check for any signs of overheating, and verify that the PCB layout and component values are correct. If the issue persists, consult the datasheet and application notes, or contact STMicroelectronics support for further assistance.

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MASTERGAN1TR Overview

Use the download button to access the MASTERGAN1TR schematic symbol, PCB footprint, and 3D model.
To find more CAD model downloads similar to this part, try a partial part number search, like MASTE, or try a keyword search, such as MOSFET Drivers

About STMicroelectronics

STMicroelectronics (ST) is a global semiconductor company that designs, manufactures, and markets a broad range of integrated circuits (ICs), discrete devices, and other electronic components. STMicroelectronics offers a diverse portfolio of semiconductor products covering a wide range of applications and industries. Their product categories include microcontrollers, analog and mixed-signal ICs, MEMS (Micro-Electro-Mechanical Systems) sensors, power management ICs, RF (Radio Frequency) transceivers, aut

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