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MAX11614EEE+T - Analog Devices

Description: 2.7V to 3.6V and 4.5V to 5.5V Low-Power 8-Channel 2-Wire Serial 12-Bit ADCs

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MAX11614EEE+T - Analog Devices PCB footprint - Small Outline Packages - Small Outline Packages - 16 QSOP
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MAX11614EEE+T - Analog Devices  - 3D model - Small Outline Packages - 16 QSOP
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MAX11614EEE+T Details

  • Manufacturer Part Number:

    MAX11614EEE+T

  • Brand Name:

    Analog Devices Inc

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    16-QSOP-150_MIL

  • Package Description:

    ROHS COMPLIANT, QSOP-16

  • Pin Count:

    16

  • Manufacturer Package Code:

    16-QSOP-150_MIL

  • Country Of Origin:

    Japan, Mainland China, Malaysia, Philippines, Singapore, South Korea, Taiwan, Thailand, USA

  • HTS Code:

    8542.39.00.30

  • Date Of Intro:

    2009-05-29

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    10

  • Analog Input Voltage-Max:

    2.75 V

  • Conversion Time-Max:

    7.5 µs

  • Converter Type:

    ADC, PROPRIETARY METHOD

  • JESD-30 Code:

    R-PDSO-G16

  • JESD-609 Code:

    e3

  • Length:

    4.9 mm

  • Linearity Error-Max (EL):

    0.0244%

  • Moisture Sensitivity Level:

    1

  • Number of Analog In Channels:

    8

  • Number of Bits:

    12

  • Number of Functions:

    1

  • Number of Terminals:

    16

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Bit Code:

    2S COMPLEMENT BINARY

  • Output Format:

    SERIAL

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SSOP

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Sample and Hold / Track and Hold:

    TRACK

  • Seated Height-Max:

    1.75 mm

  • Supply Current-Max:

    1.15 mA

  • Supply Voltage-Nom:

    5 V

  • Surface Mount:

    YES

  • Technology:

    BICMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.635 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    3.89 mm

MAX11614EEE+T Frequently Asked Questions (FAQs)

  • The MAX11614EEE+T is a high-speed, high-precision ADC, and as such, it requires careful layout and placement to minimize noise and ensure optimal performance. Analog Devices recommends following a star-grounding scheme, keeping analog and digital grounds separate, and using a solid ground plane to reduce noise. Additionally, the device should be placed close to the analog signal sources, and the analog input traces should be kept short and shielded to minimize noise pickup.
  • The MAX11614EEE+T has high-speed digital outputs that can be prone to signal integrity issues if not handled properly. To prevent this, Analog Devices recommends using a low-impedance output driver, such as a 50Ω resistor in series with the output, and terminating the output lines with a 50Ω load. Additionally, the use of a low-skew, high-speed clock signal and careful routing of the digital output traces can help to minimize signal integrity issues.
  • The MAX11614EEE+T has a specific power-up sequence that should be followed to prevent damage or malfunction. Analog Devices recommends powering up the device in the following sequence: VCC, AVCC, DVCC, and finally, the clock signal. This sequence helps to ensure that the device powers up correctly and prevents damage to the internal circuitry.
  • The MAX11614EEE+T has an internal calibration mechanism that can be used to optimize its performance and accuracy. Analog Devices recommends performing a full-scale calibration after power-up, and then periodically recalibrating the device as needed. The calibration process involves applying a known input voltage to the device and then reading the output code to determine the gain and offset errors. These errors can then be used to correct the output data and achieve optimal performance and accuracy.
  • The MAX11614EEE+T is a high-speed, high-power device that can generate significant heat during operation. To prevent overheating, Analog Devices recommends providing adequate thermal management, such as a heat sink or thermal pad, to dissipate the heat generated by the device. Additionally, the device should be operated within its recommended temperature range, and the PCB should be designed to provide good thermal conductivity and airflow.

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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