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MAX11615EEE+T - Analog Devices

Description: IC, ADC, 12BIT, 94.4KSPS, QSOP-16 Resolution (Bits):12 Sample Rate:94.4kSPS Input Channel Type:Differential, Single Ended Data Interface:Serial, I2C Supply Voltage Range-Analog:2.7V to 3.6V Supply Current:670µA

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MAX11615EEE+T - Analog Devices PCB footprint - Small Outline Packages - Small Outline Packages - E16+1
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MAX11615EEE+T - Analog Devices  - 3D model - Small Outline Packages - E16+1
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MAX11615EEE+T Details

  • Manufacturer Part Number:

    MAX11615EEE+T

  • Brand Name:

    Analog Devices Inc

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    16-QSOP-150_MIL

  • Package Description:

    ROHS COMPLIANT, QSOP-16

  • Pin Count:

    16

  • Manufacturer Package Code:

    16-QSOP-150_MIL

  • Country Of Origin:

    Japan, Mainland China, Malaysia, Philippines, Singapore, South Korea, Taiwan, Thailand, USA

  • HTS Code:

    8542.39.00.30

  • Date Of Intro:

    2009-05-29

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    10

  • Analog Input Voltage-Max:

    1.8 V

  • Conversion Time-Max:

    7.5 µs

  • Converter Type:

    ADC, PROPRIETARY METHOD

  • JESD-30 Code:

    R-PDSO-G16

  • Length:

    4.9 mm

  • Linearity Error-Max (EL):

    0.0244%

  • Number of Analog In Channels:

    8

  • Number of Bits:

    12

  • Number of Functions:

    1

  • Number of Terminals:

    16

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Bit Code:

    2S COMPLEMENT BINARY

  • Output Format:

    SERIAL

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SSOP

  • Package Equivalence Code:

    SSOP16,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, SHRINK PITCH

  • Sample Rate:

    0.0944 MHz

  • Sample and Hold / Track and Hold:

    TRACK

  • Seated Height-Max:

    1.75 mm

  • Supply Current-Max:

    1.15 mA

  • Supply Voltage-Nom:

    3 V

  • Surface Mount:

    YES

  • Technology:

    BICMOS

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.635 mm

  • Terminal Position:

    DUAL

  • Width:

    3.89 mm

MAX11615EEE+T Frequently Asked Questions (FAQs)

  • The recommended layout and placement for the MAX11615EEE+T involves keeping the analog and digital grounds separate, using a solid ground plane, and placing the device close to the analog signal sources. Additionally, it's recommended to use a 4-layer PCB with a dedicated analog power plane and a dedicated digital power plane.
  • The MAX11615EEE+T has a thermal pad that must be connected to a solid ground plane to dissipate heat. It's recommended to use a thermal via array under the device to improve heat dissipation. Additionally, the device should be placed in a well-ventilated area, and the PCB should be designed to minimize thermal resistance.
  • The recommended input impedance for the MAX11615EEE+T is 1kΩ to 10kΩ. This impedance range ensures that the device can accurately measure the input signal without introducing significant errors.
  • The MAX11615EEE+T does not require calibration. However, it's recommended to perform a system-level calibration to ensure that the device is operating within the specified accuracy. This can be done by applying a known input signal and adjusting the system gain and offset to achieve the desired accuracy.
  • The maximum clock frequency that can be used with the MAX11615EEE+T is 50MHz. However, the actual clock frequency may be limited by the system's noise tolerance and the device's power consumption.

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MAX11615EEE+T Overview

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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