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MAX1300BEUG+ - Analog Devices

Description: Serial 16-Bit ADCs

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MAX1300BEUG+ - Analog Devices PCB footprint - Small Outline Packages - Small Outline Packages - U24+1
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MAX1300BEUG+ - Analog Devices  - 3D model - Small Outline Packages - U24+1
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MAX1300BEUG+ Details

  • Manufacturer Part Number:

    MAX1300BEUG+

  • Brand Name:

    Analog Devices Inc

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    24-TSSOP_4.4-4.4_MM

  • Package Description:

    4.40 MM, ROHS COMPLIANT, MO-153AD, TSSOP-24

  • Pin Count:

    24

  • Manufacturer Package Code:

    24-TSSOP_4.4-4.4_MM

  • Country Of Origin:

    Japan, Mainland China, Malaysia, Philippines, Singapore, South Korea, Taiwan, Thailand, USA

  • HTS Code:

    8542.39.00.30

  • Date Of Intro:

    2006-11-07

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    10

  • Analog Input Voltage-Max:

    24.576 V

  • Analog Input Voltage-Min:

    -24.576 V

  • Conversion Time-Max:

    9.4 µs

  • Converter Type:

    ADC, SUCCESSIVE APPROXIMATION

  • JESD-30 Code:

    R-PDSO-G24

  • JESD-609 Code:

    e3

  • Length:

    7.8 mm

  • Linearity Error-Max (EL):

    0.0061%

  • Moisture Sensitivity Level:

    1

  • Number of Analog In Channels:

    8

  • Number of Bits:

    16

  • Number of Functions:

    1

  • Number of Terminals:

    24

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Bit Code:

    OFFSET BINARY

  • Output Format:

    SERIAL

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Equivalence Code:

    TSSOP24,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Sample Rate:

    0.115 MHz

  • Sample and Hold / Track and Hold:

    TRACK

  • Seated Height-Max:

    1.1 mm

  • Supply Current-Max:

    3.5 mA

  • Supply Voltage-Nom:

    5 V

  • Surface Mount:

    YES

  • Technology:

    BICMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    4.4 mm

MAX1300BEUG+ Frequently Asked Questions (FAQs)

  • The recommended layout and placement for the MAX1300BEUG+ involves keeping the device away from high-current carrying traces, using a solid ground plane, and placing bypass capacitors close to the device. A 4-layer PCB with a dedicated analog ground plane is also recommended.
  • To ensure proper powering and bypassing, use a high-quality, low-ESR capacitor (e.g., 10uF) between VCC and GND, and a smaller capacitor (e.g., 100nF) between VCC and AVCC. Also, ensure that the power supply is clean and well-regulated.
  • The MAX1300BEUG+ can operate over a temperature range of -40°C to +125°C, but the device's accuracy and performance may degrade at extreme temperatures. It's essential to consider the operating temperature range when designing the system.
  • To handle ESD protection, use ESD protection devices (e.g., TVS diodes) on the input lines, and ensure that the PCB design includes ESD protection features such as guard rings and ESD-safe handling procedures during manufacturing and assembly.
  • The recommended clock frequency for the MAX1300BEUG+ is between 1MHz and 10MHz. However, the device can operate at frequencies up to 20MHz, but with reduced performance and accuracy.

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MAX1300BEUG+ Overview

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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